Handset Hardware Design Development Program

Training Indian engineers to create homegrown smartphones

During November 2016 through to this month, a team of 42 engineers spent six weeks at MediaTek HQ in HsinChu, followed by another month of interaction over conference call. The education program was designed to help MediaTek's Indian smartphone partners begin to construct their own smartphone products from the ground up, rather than relying on ODMs as principal guides.

The training focused on provided:

• In-depth training program covering all aspects towards the theory of product design and hands-on experience building smartphones from scratch.
• Overview of all key hardware design domains including system design, RF, connectivity and multimedia, 12 MediaTek partners, who are major component makers within the handset ecosystem joined to deliver wider knowledge to participants.
• Soft-skills helping participants to lead a team for efficient execution of handset projects.

For an inside view, please see our behind the scenes videos of the training program.

The ultimate goal is for MediaTek partners to unique Indian smartphone products that are tailored for their home country, supporting the goals of the Make in India initiative.

The program concluded on 13th January with a closing ceremony held at MediaTek Headquarters in Hsinchu. In attendance were MediaTek Chairman and CEO, Mr. Ming-Kai Tsai, who congratulated all participants who completed the training in person, along with Mr. Ming-Ji Wu, Director General of Industrial Development Bureau at Ministry of Economic Affairs (MOEA) in Taiwan. Ms. Aruna Sundararajan, Secretary of Indian Ministry of Electronics and Information Technology (MeitY), joined the ceremony via video conference, recognizing the historical value of the training program to foster talent for India.

Mr. Sridharan Madhusudhanan, Director General, India Taipei Association and Mr. Gince Kuruvilla Mattam, Deputy Director General, India Taipei Association also attended the function and interacted with the participating Taiwanese companies and Indian engineers.

For more information please see the press release.