TAIPEI, Taiwan – Nov. 25, 2025 – MediaTek today announced that multiple papers were accepted to top‑tier global conferences in semiconductors, AI and communications, including ISSCC, NeurIPS, CVPR, ICLR, ICML, ICC, and GLOBECOM*. In addition, MediaTek Vice Chairman and CEO Rick Tsai has also been invited to deliver a plenary talk at ISSCC 2026 in San Francisco, entitled “Advancing Horizons for AI: Perspectives on Semiconductor Innovations.”
MediaTek Group, which includes AI-focused, MediaTek Research and other leading-edge research units, had papers accepted in 2025 by leading conferences and journals across IC design, AI and communications. Additionally, more than 100 papers have been jointly published or sponsored by the MediaTek Advanced Research Center (MARC) in collaboration with top global academic institutions.
Rick Tsai, Vice Chairman and CEO of MediaTek, will be giving a plenary talk at ISSCC 2026, exploring the key vectors of advanced packaging, power delivery, thermal management, high-bandwidth memory, interconnects, and wireless communication that will shape intelligent, robust AI systems for the decade ahead. Rick will illustrate how close cooperation of the semiconductor ecosystem on breakthroughs in scalable and energy-efficient architectures and cross-layer system innovation will enable exponential growth in compute, bandwidth, and power efficiency, and ultimately drive the proliferation of agentic and physical AI.
The accepted papers cover topics such as enhancing mobile CPU performance, system energy efficiency, AI-based standard cell optimization and DTCO integration, heterogeneous integration with silicon photonics, memory design, on-device generative image processing, improved computational efficiency of developing foundation models, integrated communications and computing, FR3 spectrum utilization, spectrum sharing between terrestrial and satellite networks, sustainable communications and computing, and antenna design. These advances have downstream applications in IC design, edge AI, data centers, 6G, and ESG, demonstrating forward-looking technological strength.
MediaTek has long focused on cutting-edge R&D and deepening core technologies, investing more than NT$100 billion in R&D over the past few years. Through MARC, it continues to collaborate with leading academic institutions in Taiwan and abroad, actively helping to shape international industry standards, further expanding its influence and reinforcing its technological leadership.
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About MediaTek Inc.
MediaTek (TWSE: 2454) is a global leader in fabless semiconductor design, providing solutions from the edge to the cloud. Powering over 2 billion connected devices every year, MediaTek's leading-edge technology keeps the world connected and enhances everyday life. At the forefront of innovation, MediaTek drives advancements in transformative technologies such as AI, 5G/6G, and Wi-Fi 7/Wi-Fi 8. Our high-performance, power-efficient products form the foundation for a smarter, more connected world, enabling devices from smartphones, smart homes and AI PCs to high-performance computing, automotive, and AI data centers. As a trusted partner to the world's leading brands, MediaTek leads the industry in creating solutions that meet the evolving needs of the global community, ensuring access to world-class technology for everyone. Our commitment to accelerating AI underscores our dedication to enriching the future of humanity. Visit http://www.mediatek.com for more information.
*MediaTek papers were accepted in 2025 into top conferences, such as the International Solid-State Circuits Conference (ISSCC), Conference on Neural Information Processing Systems (NeurIPS), IEEE Conference on Computer Vision and Pattern Recognition (CVPR), International Conference on Learning Representations (ICLR), the International Conference on Machine Learning (ICML) , IEEE International Conference on Communications (ICC), and IEEE Global Communications Conference (GLOBECOM).