Background
Professional kitchen equipment is rapidly evolving as manufacturers integrate digital interfaces, automation, and artificial intelligence into industrial appliances. In professional food-service environments, operators now expect high-performance touch interfaces, intelligent cooking workflows, and reliable, long-lifecycle platforms capable of operating in harsh thermal conditions. Smart industrial ovens require responsive high-resolution HMIs, local AI processing, and rock-solid supply continuity — all within tight mechanical and power constraints. These demands make platform selection a critical strategic decision rather than a simple component choice.
SECO is a high-tech company that develops and manufactures solutions for the digitalization of industrial products and processes. SECO’s hardware and software offerings enable B2B companies to easily introduce edge computing, Internet of Things, data analytics, and artificial intelligence to their businesses.
SECO supported a leading European manufacturer of Professional Kitchen Equipment (PKE), developing intelligent high-performance appliances for professional food-service environments, in migrating a new smart appliance platform to a MediaTek-powered SOM. The target product was a smart industrial oven, designed to deliver advanced touch-based HMI with smooth graphics and on-device edge AI capabilities.
Critical Needs
During development of a new smart industrial oven platform, the OEM faced an unexpected disruption: the originally selected edge-AI module family entered End-of-Life, creating immediate risk to supply continuity, production timelines, and the long-term product roadmap.
Industrial Longevity
The need for guaranteed 10+ year availability to support industrial product lifecycles.
HMI Performance
Supporting smooth, responsive, high-resolution touch interfaces for professional use.
Thermal & Mechanical Constraints
Reliable operation in a heat-intensive industrial oven environment with limited space for cooling
AI Readiness
Preserving on-device edge AI capabilities for intelligent appliance features.
Time-to-Market Pressure
Minimizing redesign effort to avoid delays and protect launch schedules.
MediaTek Solution
SECO addressed these challenges by migrating the platform to the SECO SOM-SMARC-Genio510, a SMARC System-on-Module powered by the MediaTek Genio 510.
The Genio 510 platform delivers an optimal balance of performance, power efficiency, and industrial longevity. Built on a 6nm process, it is designed for fanless, low-power embedded applications while supporting advanced graphics and AI acceleration. The Genio 510 also meets the longevity supply requirements for this application.
Key solution highlights:
- Carrier Board Review & Adaptation: Ensuring SMARC connector and pinout compatibility to reduce redesign effort and accelerate development.
- Custom Thermal Engineering: Designing a dedicated heatsink solution to manage thermal load within the oven’s high-temperature environment.
- Software Enablement with Clea OS: Enabling full access to MediaTek’s APU and NPU acceleration through SECO’s Clea OS, simplifying AI and graphics integration while reducing low-level development complexity.
This integrated hardware-plus-software approach allowed the OEM to migrate platforms quickly without sacrificing performance or future scalability.
