In recent weeks, we’ve launched several new Dimensity chipsets that are powering everything from mainstream to premium smartphones.
First up, look out for the Dimensity 6500 and Dimensity 6360, which offer a suite of power efficiency advantages, advanced camera capabilities, and speedy gaming performance, with the 6500 also adding new long-range Bluetooth support.
The Dimensity 6500 enables up to 19% greater power efficiency than previous-generation chips across 20 common user scenarios, and when compared to alternative chips, it delivers 18% faster CPU speeds and a smoother UI experience. Meanwhile, super-fast 5G benefits from MediaTek UltraSave 3.0+ power efficiency enhancements, along with situationally aware connectivity optimizations.
In the tier above, you’ll now find the new efficiency-focused Dimensity 7300e, which has integrated system-wide efficiency enhancements that can achieve up to 4% greater efficiency in apps, 21% in the modem, and 8% in gaming. All while CPU performance is improved by 8%, and gaming performance by 6%, compared to the previous-generation chip. It also supports 17% larger display resolutions than its predecessor, allowing smartphone designers to pack in more pixels.
Meanwhile, the twin chipsets, Dimensity 7450X and Dimensity 7450, now feature an upgraded R17 specification 5G modem, which includes an efficient high-speed rail mode and faster connection recovery. MediaTek Adaptive Gaming Technology 3.0 with Network Observation System (NOS) optimizes gaming performance, connectivity, and power efficiency, while AI optimizations deliver 7% faster performance. The ‘X’ variant also supports dual displays designed for flip phones.
Moving into the premium tier, you’ll find the new Dimensity 8550. Focused on advancing AI with the latest innovations, it includes a new LLM Booster and support for the latest Google Gemini Nano V3. These features are complemented by key technologies such as Diffusion Transformer support, mixed precision data support, and speculative decoding for LLM acceleration. The smart silicon behind these features is the powerful NPU 880, which delivers considerable edge AI capabilities, enabling advanced generative AI acceleration.
The premium features continue with its advanced All-Big-Core CPU, supported by large in-chip caches, a powerful 8-core GPU, a large system cache that every processor can access, and the latest 5G-Advanced modem. For cameras, there’s support for special QPD-Bayer QPD sensors that enable devices to capture more light, lock onto subjects faster and more precisely, and deliver stunning high-resolution photos and videos, plus AI-powered Zero Shutter Lag (ZSL) photography.
