At ISSCC 2026, Rick Tsai, Vice Chairman and CEO of MediaTek, delivered a compelling keynote titled “Advancing Horizons for AI: Perspectives on Semiconductor Innovations." In his address, Tsai explored how breakthroughs in semiconductor design are accelerating the next wave of artificial intelligence, highlighting the critical role of system-level innovation, power efficiency, and scalable architectures in shaping the future of AI-enabled devices.
Abstract
AI is redefining the semiconductor landscape. Exponential growth in compute, bandwidth, and power efficiency is driving the proliferation of agentic and physical AI. The paradigm is shifting from performance alone to breakthroughs in scalable and energy-efficient architectures and cross-layer system innovation with close cooperation across silicon, design, heterogeneous hardware integration, and software. This plenary explores the key vectors of advanced packaging, power delivery, thermal management, high-bandwidth memory, interconnects, and wireless communication that will shape increasingly intelligent, robust AI systems for the decade ahead.
