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    MediaTek
    at MWC 2026

    AI for Life: from Edge to Cloud

    Barcelona, Spain, Fira Gran Via,  
    Hall 3, Booth #3D10  
    March 2-5, 2026

    Overview

    Experience AI for Life with MediaTek at MWC 2026, which offers an exclusive glimpse into the future of intelligent living, powered by the world's most advanced AI and next-generation connectivity.
    Our simple yet bold mission is to make breakthrough technology accessible and impactful for everyone. We showcased what is possible in how people live, move, and connect in everyday life.
    Visitors immersed themselves in a world of innovation spanning personal devices, smart homes, next-generation PCs, connected cars, and intelligent infrastructure. Highlights include smart glasses, transformative Gen-AI-enabled smartphones, and the latest advances in 6G, Wi-Fi 8, and automotive technology.

    The Essentials

    Keynote Highlights | Booth Overview

    Day 4, Mar 5th

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    Keynote Highlights | Booth Overview

     

    Day 4, Mar 5th

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    Discover Our Technologies
    Mobile & IOT
    Dimensity Instant AI Portraits On-Device

    MediaTek Dimensity 9500

    • Unlimited, fast, personalized portraits
    • On-device AI: Create anytime, anywhere
    • Instant, private, reliable results  
    Dimensity 4K On-Device AI Image Generation

    MediaTek Dimensity 9500

    • Pioneering ultra-high-quality 4K image generation
    • On-device text-to-4K image creation with no internet or cloud service required
    • Instant, personal, and reliable
    • Supports DiT-based generative models to enhance productivity
    • Unlocks limitless creativity and productivity
    Dimensity AI Omni Experience on Glasses

    MediaTek Dimensity 9500

    • Industry-leading AI glasses experience powered by the Dimensity 9500
    • Smartphone handles all compute enabling ultra-light weight glasses 
    • Demonstrates a state-of-the-art Omni model running fully on-device.

    Key advantages vs cloud-supported AI glasses include: 

    • Robust, low-latency interaction
    • AI processing kept between personal devices to enhance privacy
    • Omni multimodal large model supports native text, image, speech, and video interaction 
    Dimensity AI Telephoto: Pro Zoom in Your Pocket

    vivo X300 Pro with Zeiss Telephoto Extender MediaTek Dimensity 9500

    Setting new standards in telephotography: Capture every detail in 200MP of AI-enhanced precision. 

    • Powered by the MediaTek Dimenisty 9500 AI-ISP, its telephoto imaging enables stunning 200MP captures that reveal extraordinary detail in every shot.
    • The AI-ISP uses the latest computational photography developments with AI-driven enhancements to deliver unmatched clarity, even at extreme zoom levels.
    Dimensity AI Telephoto: Pro Zoom in Your Pocket

    OPPO Find X9 Pro with Hasselblad Teleconverter MediaTek Dimensity 9500

    Setting New Standards in Telephotography: Capture Every Fine Detail with 200MP Precision.

    • Powered by MediaTek’s D9500 ISP & RAW processing engine, this solution ushers in a new era of telephoto imaging, enabling stunning 200MP captures that reveal extraordinary fine points in every shot.
    • Enhanced by Imagiq ISP's EIS/Resolution performance, the teleconverter's zoom capabilities allow you to experience the image quality of a DSLR's large lens on your smartphone.
    Dimensity On-Device Camera Agent

    vivo upcoming smartphone MediaTek Dimensity 9500

    An AI assistant that understands the scene and guides you to the perfect shot. 

    •  Powered by the MediaTek Dimensity 9500 NPU, the system delivers advanced scene analysis and seamless natural language interaction, processed entirely on-device with ultra-low power consumption.
    • It proactively infers your creative intent to provide intelligent composition guidance, automatically calibrating all settings to ensure you capture the best possible result in every shot.
    Dimensity Console-Grade Gaming

    Total Football: High Framerate and Ultra-Fast Response MediaTek Dimensity 9500

    Elevating mobile gaming to experience true console-level performance powered by the latest mobile GPU technology.

    • MediaTek, in collaboration with GALA Sports’ Total Football, brings console-level graphics and enthusiast-grade responsiveness to mobile devices.
    • Witness 60 fps vs 120 fps side-by-side in real gameplay, showcasing the dramatic leap in smoothness, detail, and immersion. 
    Dimensity Console-Grade Gaming

    Arena Breakout: Powerful Hardware-Based Ray Tracing

    MediaTek Dimensity 9500

    Experience true-to-life lighting and shadow effects without the performance compromise.

    The Dimensity 9500 is the industry's first smartphone chip capable of ultra-high frame rate (120FPS) raytracing in the most popular mobile games.

    Dimensity Console-Grade Gaming

    NTE: High-Quality Gaming Powered by Advanced UE5 Engine

    MediaTek Dimensity 9500

    MRFC 3.0

    Boosting frame-rate from 60 fps to 120 fps, ensuring an ultra-smooth, high-frame-rate gameplay experience. 

    Ecosystem Partnership

    Uses custom algorithms and UI-separated or non-separated color buffers, game motion and depth information to fine-tune graphics quality and performance. An end-to-end optimization that ultimately delivers higher-quality, smoother gameplay.

    vivo X300 Pro

    MediaTek Dimensity 9500

    Live Cutout

    • NPU-powered subject segmentation with millisecond response
    • AI Magic Move powers instant cut-outs from images
    • Privacy and security by design as originals never leave the device

    Snap Text

    •  Ultra-fast OCR: text identification and extraction in milliseconds
    • Accelerated pipeline: detection + recognition in real-time
    OPPO Find X9 Pro

    MediaTek Dimensity 9500

    AI Portrait Glow

    • Always in the best light, in any condition
    • NPU-powered scene and facial detail analysis
    • Visible, refined, and natural enhancements for every portrait

    AI Translate

    • Translate anything, anywhere instantly and precisely
    • NPU-powered real-time natural language translations
    • On-device by design ensures private, reliably fast and accurate responses even when offline
    Google

    MediaTek Dimensity 9500

    Gboard built with Gemini Nano

    • On-device processing: Gemini Nano runs locally, keeping messages and suggestions secure and private
    • AI writing tools provide support for proofreading and rephrasing 
    Infinix Note 60 Ultra

    MediaTek Dimensity 8400

    The in-chip NPU 880 powers the AI Health Assistant feature, enabling the following:

    • Pioneering hybrid computing
    • On-device personal data storage and processing
    • Sensor-based vital signs monitoring with personalized health advice
    TECNO CAMON 50 Ultra 5G

    MediaTek Dimensity 7400

    The in-chip NPU 655 powers the AI Studio feature, enabling the following:

    • 3D Photo (on-device)
    • Globally deployable artistic image-to-image solution (Hybrid)
    • First, real-time preview of stylized generation effects (Hybrid)
    Timekettle X1 AI Interpreter Hub

    MediaTek MT8768

    This pocket-sized device breaks language barriers with seamless, real-time translation. It allows you to instantly connect across multiple languages, making it ideal for international collaboration and global communication.

    One-on-One Mode:

    Press once to share the earbuds and start enjoying authentic, real-time conversations.

    Listen and Play Mode:

    Simply wear the earbuds to hear translations during meetings, speeches, or any other occasion. 

    TransAI Meeting Notetaker

    MediaTek Genio 720

    TransAI Meeting Notetaker leverages the in-chip NPU to capture, transcribe, and summarize every meeting into insightful notes, entirely on device.

    iMin Crane1 Kiosk

    MediaTek Genio 700

    The iMin Crane1 is tailored for high-volume operations, featuring an advanced octa-core processor and Google EDLA (Enterprise Device Licensing Agreement).

    It effectively supports all features, including scanning and printing, in retail scenarios. 

    Automotive
    World's First 5G NR NTN Video Call on Auto

    Faster, More Reliable and Responsive Satellite Connectivity

    MediaTek Dimensity Auto MT2739

    MediaTek’s next-generation MT2739 5G-A telematics platform, supports 3GPP Release 17 NR-NTN technology, extending 5G connectivity beyond terrestrial networks, this advancement enhances coverage and reliability in areas where traditional networks are unavailable.

    Industry-Leading 5G-A R17/R18 Auto Telematics Platform

    Optimizing Cellular Performance and Reliability with In-Modem AI

    MediaTek Dimensity Auto MT2739

    MediaTek’s next-generation MT2739 5G-A Telematics Platform, supports 3GPP Release 17/18 with in-modem AI technology, ensures stable, reliable, and high-performance connectivity. 

    • Supports downlink 5CC with up to 400MHz bandwidth, delivering peak throughput of up to 9Gbps,
    • Supports advanced uplink 3Tx capability,
    High-Performance Computing Platform

    World's First Dual 7B Model Automotive Solution

    MediaTek Dimensity Auto C-X1

    Supports two simultaneous 7B-size AI models on a single chip Proactive AI: Monitors internal and external environments, provides timely recommendations and reminders Interactive AI:

    Engages in natural conversations with passengers, enables service invocation Unmatched AI performance and efficiency for next-generation smart cockpits Global exclusive platform for advanced multi-agent automotive AI.

    Smart Scalable Cockpit

    Powerful Auotmotive-grade 3nm SoC

    MediaTek Dimensity Auto C-X1

    • Extremely powerful multi-core CPU with cutting-edge ARMv9.2 architecture.
    • Powerful Arm Avalon GPU delivers a high-end entertainment experience.
    • Console-grade gaming with ray tracing.
    • High performance NPU for private, personal and secure in-vehicle Gen-AI applications.
    Connectivity
    Next-Gen CPE Featuring Wi-Fi 8

    MediaTek T930 + MediaTek Filogic 8000

    Combinging MediaTek’s industry-first Wi-Fi 8 chip with MediaTek flagship 5G-A CPE platform to create the world's first truly next-generation gateway and wireless network experience.

    Wi-Fi 8 Technology Advancements

    • DSO enables devices with different capabilities to transmit simultaneously across subbands, improving throughput by up to 2× and reducing latency in congested environments.
    • NPCA enables devices to use subbands to avoid interference from OBSS or other interference sources, increasing throughput and reducing latency in busy/noisy network environments. 
    Powering Up Fixed WirelessAccess (FWA)

    MediaTek T930

    World’s 1st Uplink 3Tx 3CC

    Up to 5 MIMO layers provide up to 40% higher uplink throughput.

    3CC 8Rx Downlink Diversity

    Delivers over 40% improvement in spectral efficiency to support more subscribers. 8Rx diversity ensures stable 4-layer performance downlink in real-world environments.

    Higher Power: 31 dBm 1Tx PC1

    Higher uplink power expands cell site coverage, enables rural connectivity, and ensures strong uplink performance and capacity at the cell edge.

    Edge AI-Driven Smart Antenna Evolution

    Gen-AI Edge Learning

    MediaTek AI

    MediaTek Modem AI (MMAI)

    Unlocking deeper understanding, crafting intelligent interactions for every scenarios you care about.

    Smart Antenna Evolution

    Using edge AI antennas can sense the spatial difference between human vs object contact, adjusting Tx power accordingly.

    6G for Physical AI

    World’s 1st 6G Radio Interoperability MediaTek 6G Test Platform

    6G x Physical AI

    Robots can leverage 6G edge compute services to support compute-intensive applications, ensuring responsive performance on demand.

    World’s First 6G Radio Interoperability

    6G radio enables new flexibility to mix throughput, latency, robustness, and power optimization to support wide-ranging generative, agentic or other AI services.

    Multi-Device Agentic AI

    Low-latency, intent-driven communication and computing enable seamless collaboration across multiple devices 

    AI for 6G Uplink

    AI-Accelerated Uplink Transmit Diversity (TxD) MediaTek AI

    Gen-AI Optimization

    Enhances uplink traffic specifically for generative AI workloads.

    Real-Time Adaptation

    Provides instant OTA updates for AI models, allowing them to match dynamic channel conditions.

    Proven Performance

    Delivers up to a 160% gain in uplink cell-edge throughput compared with traditional rule-based TxD.

    Partnerships

    Developed in collaboration with Keysight and vivo.

    6G Device Cloud for Agentic AI

    Collaborative Computing and Connectivity

    MediaTek 6G

    Seamless AI Experience

    Uninterrupted, secure context sharing whether at home or beyond.

    Cross-Device Orchestration

    Unified AI computing across CPE, PC, and mobile devices within an Intelligent Personal Device Cloud.

    Cross-Device Collaborative MIMO

    Aggregation of antenna resources across multiple devices, such as a smartphone and a car, to improve cell-edge throughput. 

    Compute
    World's Smallest Super computer for AI Developers

    NVIDIA DGX Spark

    NVIDIA GB10 Grace Blackwell Superchip

    Designed in collaboration with MediaTek, NVIDIA DGX Spark™ delivers up to 1 petaFLOP of FP4 AI performance in a power-efficient, compact form factor, enabling developers to prototype, fine-tune, and run inference on large AI models locally.

    World's First N2P/N3P UCIe-ADie-to-Die Interconnect

    In-house designed UCIe Advanced IP

    • Silicon validation completed on TSMC 2nm and 3nm processes.
    • Data-rates of up to 32 Gbps per lane.
    • Achieves up to 10 Tbps per millimeter of die-edge bandwidth density.
    • Delivers superior performance with low bit error rate.
    • UCIe health monitoring.
    • Support high-density advanced packaging technologies, including silico
    MediaTek Coherent-LiteCo-Packaged Optics for AI Compute

    Path to 4x Bandwidth per Fiber

    MediaTek's in-house designed EIC and PIC to explore pathways toward higher bandwidth density, up to 400 Gbps per fiber.

    • Direct-reach DR DP16QAM
    • Socketed solution for improved serviceability
    • Higher beachfront density
    • Lower energy per bit
    • High level of heterogeneity
    • Full supply-chain readiness: 
      1. Electrical–optical integration and SIPI 
      2. Thermal and mechanical design, packaging, fabrication, and assembly 
      3. Fiber attachment

    Discover Our Technologies

    Mobile & IoT

    Dimensity
    Instant AI Portrait

    • Unlimited, fast, personalized portraits
    • On-device AI: Create anytime, anywhere
    • Instant, private, reliable results

    DISCOVER OUR TECHNOLOGIES-image

    Automotive

    World's 1st 5G NR-NTN Automotive Video Call

    MediaTek’s Telematics SoC powers 5G next-generation eCall, enabling OEMs and Tier-1 suppliers to deliver seamless, regulatory-compliant emergency connectivity in the 5G ecosystem.

    artificial-intelligence

    Connectivity

    World's 1st
    AI Interpreter Hub

    This pocket-sized device breaks language barriers with seamless, real-time translation. It allows you to instantly connect across multiple languages, making it ideal for international collaboration and global communication.

    artificial-intelligence

    Compute

    World's 1st N2P/N3P
    UCIe-A Die-to-Die Interconnect

    • Silicon validation completed on TSMC 2nm and 3nm processes.
    • Data-rates of up to 32 Gbps per lane.
    • Achieves up to 10 Tbps per millimeter of die-edge bandwidth density.
    • Delivers superior performance with low bit error rate.
    • UCIe health monitoring.
    • Support high-density advanced packaging technologies, including silicon interposers and silicon bridges.

    artificial-intelligence

    Compute

    MediaTek Coherent-Lite
    Co-Packaged Optics
    for AI Compute

    MediaTek's in-house designed EIC and PIC to explore pathways toward higher bandwidth density, up to 400 Gbps per fiber.

    artificial-intelligence

    Key Technologies

    Discover a wide range of industry-leading technologies we exhibited. Scroll through and learn more about them below:

    Events AI Photo Remastering

    AI Photo Remastering uses the Dimensity NPU to power targeted repair recommendations that can correct imperfections in photos, including removing reflections, unblurring images, and intelligently erasing unwanted elements, as well as enhancing photo clarity.

    Events Magic Compose

    Magic Compose is an AI-driven text generation tool that offers smart suggestions and diverse writing styles to enhance messaging efficiency and improve communication.

    Events Super Documents

    Super Documents combines a series of document image related services such as correction, enhancement and shadow removal.

    Events Live Cutout

    Live Cut allows selective cutting of a subject, avoiding the need for tedious manual cutting using complex and inaccurate tools. It provides a fast response and excellent dynamic effects even with multi-subject scenarios. Powered by MediaTek NPU ensures data privacy and security.

    Events Super Fun Gen-AI Moving Portraits

    MediaTek and Kuaishou Technology join forces to enhance the capabilities of Stable Diffusion. With the AnimateDiff video generation model and I2V-Adapter technology, static images are swiftly turned into enchanting animations. Integrated with ControlNet technology for a better understanding of body posture, we bring your creativity to life in more fascinating ways.

    Events Ultra Realistic PC-grade Raytracing

    Games featuring new Opacity Micro-Maps (OMM) efficiently add visual detail, lowering power consumption and achieving realistic effects in complex materials.

    Events Spatial AI Audio Recording

    New AI Audio Focus intelligently eliminates background interferences to focus purely on the main source of sound in the shot, allowing you to capture what matters in the moment. The new technologies uses MediaTek's 8th generation NPU.

    Events Super Gen-AI Telephoto

    An advanced camera system engineered to merge telephoto photography with Generative AI to enhance a blocky zoom image with corrective fill that can learn and produce pin-sharp results.

    Events Lightning Snapshot Camera

    The best snapshot camera designed for quickly capturing moments with minimal effort and setup, characterized by its ease of use, portability, and ability to take high-quality photos with just a simple click.

    Events Multi-modal Gen-AI Automotive Cockpit Platform

    DriveOS supports multiple VMs. Multi-model Gen-AI application ready Cutting-edge CPU with ARMv9.2 architecture Incredibly powerful Nvidia GPU

    Events Next Generation 5G eCall

    MediaTek Telematics SoC provides 5G next-generation eCall that empowers OEMs and Tier-1 automotive suppliers with a highly capable solution that meets regulatory needs in the 5G cellular ecosystem.

    Events 224G DSP-based SerDes for Custom ASIC

    MediaTek’s 224G SerDes IP is central to our custom ASIC design offerings. We collaborate with major foundries on advanced process nodes, chip-to-chip communication, high-speed IO, on-package memory, and ultra-large integration; all while optimizing performance, power, and area (PPA) through Design Technology Co-Optimization (DTCO).

    Events 5G Gen-AI Gateway

    Powered by MediaTek T830, including 3TX super-fast uplink, and L4S scalable low latency.

    An intelligent CPE that decentralizes Gen AI computing, providing several advantages:

    • User data remains within a local domain to strengthen data governance and enhance data privacy for homes/business.
    • AI Agents work with broader context based on both personal and local context to make the output more useful.

    Events World’s 1st 5G-A NR-NTN LEO Satellite Connection

    5G Satellite Broadband – World’s 1st OTA Success with Commercial OneWeb Gen.1 LEO Satellite

    • Partnership with Eutelsat Group, AIRBUS, ITRI, R&S and Sharp for End-to-End Connectivity
    • Innovative Modem-Array Interface and Ephemeris-based UE Beam Tracking Technology for Massive Phased Array Antenna
    • Applicable to automotive and CPE use cases

    Events 6G Hybrid Computing

    6G Edge Cloud = Device Cloud + RAN

    Extending ambient computing from device to RAN, achieving: 

    • Low latency
    • Carrier-grade privacy & personal data governance
    • Dynamic computing resource scheduling with Integrated Computing & Communication (ICC) framework on RAN & edge devices

    Events Ultra Efficient Sub-Band Full-Duplex

    Unparalleled performance for handheld devices using 6G unpaired spectrum enabled by simultaneous transmission and reception in same frequency channel. 

    Extract full potential of unpaired 6G spectrum:

    • Enhanced uplink coverage +43%
    • 2x higher network capacity
    • 2x lower latency – richer user experience for XR and gaming applications
    • Feasible on Smartphone Form Factor

    Events Envelope Assisted RFFE System

    • Envelope assisted RFFE system for highly efficient PA with dynamic fitting supply voltage, improving power efficiency
    • Improved uplink performance

    Events Concurrent FR1 + FR2 Connectivity

    MediaTek M90 achieved simultaneous 5G NRDC FR1+FR2 connectivity at ~10Gbps downlink speed in a live network, in collaboration with Ericsson and Telstra.

    Events Smart AI Antenna

    • Body proximity sensing (embedded system)
    • AI gesture detection
    • 24% faster low-band uplink throughput with power and antenna tuning optimization.