English
    asics_campaign_mob

    Create consumer ASIC solutions with MediaTek

    From concept through support, MediaTek has you covered.

    Learn more
    MediaTek-Generic

    Consumer ASIC

    MediaTek's Consumer ASIC are known for their performance, efficiency, connectivity, multimedia capabilities, and customization options, making them a leading choice in the semiconductor industry. 

    These chips integrate multiple hardware components, use power efficient packaging technologies, support various wireless communication technologies, provide advanced multimedia features, and prioritize security, making them a compelling choice for device manufacturers looking to build innovative and differentiated consumer products.

    MediaTek's Consumer ASIC are custom‑designed chips that offer high‑performance, low‑power, and cost‑effective solutions for a wide range of consumer electronic devices, such as smartphones, tablets, smart TVs, wearables, gaming consoles, and more.

    Meeting the Challenges of Your Application

    Consumer Electronics products are often required to meet a wide variety of challenges, depending on their end-user application. MediaTek is an expert in maintaining high-performance and low latency in power constrained situations, and can actively balance a multitude of compute elements within an SoC in response to user behavior.

    MediaTek has expertise to design ASIC solutions for CE devices using Arm Cortex CPUs, advanced graphics IP, high performance on-chip/inter-chip interconnects, large embedded SRAM, accelerators for multimedia, cameras and displays, and diverse memory and storage options. We are also one of the few global semiconductor companies to offer comprehensive wireless connectivity IP that includes Bluetooth, Wi-Fi, global cellular, LPWAN, and satellite.

    The Process

    Feasibility Study

    Feasibility Study

    We work with you to understand and enable your idea, with special attention to high‑performance designs in highly power constrained situations, and unique environmental operations or use‑cases.

    Development

    Development

    Our world‑class engineers will design and develop your ASIC to specification. MediaTek provides expert support for ASIC design, testing, and validation, which can help companies reduce time‑to‑market and ensure product quality.

    Manufacture Test Assembly Package

    Packaging

    We provide support for monolithic SoC, MCM or SiP designs, using 2D, advanced 2.5D or the latest 3D packaging technologies enables the widest possibility of cutting‑edge chip designs.

    Longevity - Support

    Longevity & Support

    MediaTek ASIC solutions are designed for long‑term use, with a focus on reliability and durability, which can help companies avoid costly redesigns and replacements.

    Project launch

    Project launch

    At this stage we spec the solution and bring together IP elements from MediaTek and 3rd party suppliers.

    Manufacturing

    Manufacturing

    MediaTek has extensive partnerships with all of the leading suppliers in the SoC manufacturing chain; from foundry partners, to assembly, packaging and testing. If customers have preferred partners, this requirement can be accommodated.

    Logistics

    Logistics

    Global business scale shipping in reliable supply channels.

    Power-consumption

    Power Consumption

    With our expertise in mobile products, our innate understanding of power efficiency maximizes performance per watt, and performance per dollar. MediaTek’s ASIC solutions are designed to be exceptionally power-efficient and are ideal for battery-powered devices, expending energy to precisely meet user experience expectations, which can reduce power consumption compared to general-purpose platforms.

    Advanced Packaging

    The choice of chip packaging is crucial to leading-edge chip design. MediaTek’s assured supply chain and partner ecosystem can accommodate monolithic silicon die designs with the ability to accommodate a single large area, and multi-chip module using various 2D, 2.5D or 3D layering on active or passive packages. Our extensive expertise allows us to meet a wide array of challenges in layout, yield, power consumption and thermal design at the initial feasibility and design stage, ensuring the optimal direction is selected from the very start.

    • Leading expertise in performance, power, thermal & cost factors
    • SoC, SiP, MCM chip design
    • 2D, 2.5D, 3D chip design
    • Active/passive packaging

    Longevity and Support

    With a commitment to contributing to global technology standards, our deep partner ecosystem and global sales reach, MediaTek has a long track record of demonstrating successful time-to-market delivery while pursuing all client environmental and sustainability targets. Collaborating with us on a project ensures a long-term commitment and support to ensure your success.

    Please contact MediaTek ASIC design solutions, and let's start a discussion about your custom chip design needs.