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    MediaTek Genio 360

    MediaTek
    Genio 360

    GenAI capable, 6nm, hexa-core, value-tier IoT platform

    MediaTek Genio 360
    MediaTek Genio 360

    Overview

    The MediaTek Genio 360 is an advanced, 6nm, IoT platform that brings high-tier features to the value segment, featuring an advanced hexa-core CPU configuration consisting of a single Cortex-A76 big core and a 5-core Cortex-A55 configuration. The Genio 360 enables edge GenAI on models under two billion parameters, powered by an on-chip 8th generation MediaTek NPU capable of 5.1 TOPS. The platform enables a rich multimedia experience with support for a single 4K60 display or dual displays at FHD60 resolution, a single 16MP camera at 30fps and 4K video decode.

    With a rich I/O capability including PCIe Gen2, USB 3.2 Gen1, dual USB 2.0 and GbE MAC (TSN) interfaces available, a wide variety of system expansion is possible. Offering support for Android, IoT Yocto, and Ubuntu OS, Genio 360  allows for a wide range of consumer, industrial and enterprise applications. Guaranteed longevity of supply for 10 years and both commercial & industrial temperature ranges round out the support for intelligent embedded solutions.

    Key Features

    High Performance

    High Performance Computing

    1x Arm Cortex-A76 @ 2.0 GHz, 5x Arm Cortex-A55 @ 2.0 GHz, delivers efficient edge performance in 6nm process technology.

    AI & Visual Processing

    Edge GenAI Processing

    Integrated 8th Gen NPU delivers 5.1 TOPS for efficient real-time inferencing of LLMs and transformer models.

    Enhanced Camera Capabilities

    Balanced Camera Capabilities

    Single ISP supports 16MP or 6x FHD camera, ideal for AI-edge use in compact or cost-sensitive devices.

    High‑Resolution Display Support 4K

    High-Resolution Display Support

    Enable up to single 4K60 or dual FHD60 displays with advanced video encoding/decoding.

    Flexible Expansion

    Flexible Expansion and Integration

    Support for PCIe Gen2, USB 3.2, USB 2.0 and GbE simplifies system design and peripheral integration.

    Operating Systems

    Operating Systems

    Supports Android, Yocto Linux and Ubuntu.

    Product Specification

    Process

    Process

    6nm

    Processor

    Processor (CPU)

    [Genio 360) Consumer
    1x Arm Cortex-A76 (2.0GHz)
    5x Arm Cortex-A55 (2.0GHz)

    [Genio 360] Industrial
    1x Arm Cortex-A76 (1.9GHz)
    5x Arm Cortex-A55 (1.7GHz)

    [Genio 360P] Consumer
    2x Arm Cortex-A76 (2.0GHz)|
    6x Arm Cortex-A55 (2.0GHz)

    [Genio 360P] Industrial
    2x Arm Cortex-A76 (1.9GHz)
    6x Arm Cortex-A55 (1.7GHz)|

    Graphics Processor (GPU)

    Arm Mali-G57 MC2 (700 MHz)
    OpenGL ES 3.2, Vulkan 1.1, OpenCL 2.0

    Neural Processing Unit (NPU)

    MediaTek 8th-Gen NPU
    (1x MDLA5.3, GenAI)

    [Genio 360] 5.1 TOPS

    [Genio 360P] 7.4 TOPS

    Memory and Storage

    Memory and Type

    x32 LP4X-3733 (up to 8GB)

    Storage Type

    eMMC5.1

    SD 3.0

    SPI-NOR

    Multimedia

    Display Interface

    1x MIPI-DSI (4L, 2.5Gbps/L) / LVDS

    1x MIPI-DSI (4L, 2.5Gbps/L)

    1x DP1.4/eDP1.2 (4L)

    Display Controller

    Dual Display, Max. FHD60+FHD60

    Single Display, Max. 4K60

    (Support PQ)

    Video-in Interfaces

    2x MIPI-CSI (4L)

    (Virtual channel: Up to 6x FHD30)

    Image Signal Processor

    1x ISP (3A, NR, AI-FD, LSC)

    Single camera: 16MP @ 30fps

    Video Decode

    H.264/H.265/VP9 (4K30)

    Video Encode

    H.264/H.265 (FHD90)

    Interfaces

    USB

    2x USB 2.0 (Host)

    1x USB 3.2 Gen1 (Host)

    Ethernet

    1x GbE MAC (TSN)

    PCIe

    1x PCIe 2.0 (1L, RC, WoWLAN)

    CAN

    1x CAN-FD

    UART

    4x UART

    I2C

    8x I2C, 2xI2C/I3C

    SPI

    6x SPI Master

    PWM

    3x PWM

    I2S/TDM

    2x I2S/TDM input 

    2x I2S/TDM output

    PDM

    4x PDM input

    PCM

    1x PCM input/output

    Temperature Support

    Temperature

    Consumer: -20°C to 95°C (Tj)

    Industrial: -40°C to 105°C (Tj)

    Package Information

    Package Type

    VFBGA

    Package Dimensions

    12.2mm x 13.4mm x 0.9mm, 0.4mm ball-pitch

    Wireless Connectivity

    Integrated Wi-Fi Baseband

    WiFi-5 1x1/Bluetooth 5.3 (MT6631)

    Security

    Security

    ARM TrustZone

    Security Boot (RSA4096)

    Crypto Engine

    RNG