Here's the top reasons why you'll want a MediaTek Dimensity 9000 inside your new smartphone in 2022:
1. The World’s First TSMC 4nm-Class Smartphone Chip
The MediaTek Dimensity 9000 leads the industry by adopting TSMC’s cutting-edge N4 (4nm-class) production process, which is the most advanced and power-efficient chip-making technology to date.
2. Cortex-X2 CPU Clocked Over 3GHz
The latest Armv9 architecture CPUs deliver unparalleled performance. The chip includes the most powerful Arm CPU designed to date, the Cortex-X2, achieving a best-in-class frequency of 3.05GHz.
3. Big Caches
The silicon features multiple in-chip caches that store critical data as close as possible to processing components such as the CPU, GPU, and APU, enhancing both performance and power efficiency. The Dimensity 9000 includes an 8MB CPU L3 cache—the largest in its class—accessible by all 8 CPUs; a GPU cache that boosts the Mali-G710 MC10 graphics engine; an APU cache integrated into the fifth-generation AI processor; and a 6MB system-level cache (SLC), the largest among flagship Android smartphone chips. The SLC, unique to the Dimensity 9000, is dynamically partitionable to meet the real-time needs of multiple processing units simultaneously.
4. LPDDR5X Memory at 7500Mbps
MediaTek continues its tradition of firsts by integrating the latest LPDDR5X standard, offering faster speeds (7500Mbps vs. 6400Mbps for LPDDR5) and up to 20% power savings. MediaTek collaborated with Micron, a leading memory manufacturer, to validate the Dimensity 9000 with LPDDR5X technology.
5. Triple-Camera Simultaneous Video Recording
The 18-bit HDR ISP design enables users to capture HDR video from three cameras simultaneously. With a remarkable 9Gpixel/s ISP, the chip can record frames with three exposures merged into each frame for accurate HDR. Each pixel captures 18 bits of data, offering professional-grade raw details.
6. World’s First 320MP Camera Support for Smartphones
The Imagiq 790 supports the largest camera sensors ever conceived—when they’re available! The Dimensity 9000 is future-ready, enabling device manufacturers to pair it with sensors up to 320MP, paving the way for innovative smartphone designs and unprecedented photo quality.
7. MediaTek APU 590
The fifth-generation AI processor features comprehensive upgrades that maximize efficiency at every stage of the AI pipeline. It delivers up to 4X power efficiency compared to its predecessor and is optimized for AI-driven multimedia, gaming, camera, and social video experiences. MediaTek's expertise in video, imaging, and graphics ensures seamless integration of AI and other processing units for enhanced performance.
8. MediaTek HyperEngine 5.0
Now in its fifth generation, HyperEngine technology introduces significant improvements in resource management, networking, picture quality, and rapid response capabilities. Noteworthy advancements include the first AI-enhanced variable-rate shading (AI-VRS) and the industry’s first ray tracing SDK for Vulkan on Android.
9. World’s First Arm Mali-G710 MC10 GPU
The Dimensity 9000 debuts the Mali-G710 graphics engine, the latest and most powerful Arm GPU design.
10. 144Hz WQHD+ or 180Hz FullHD+ Display Support
The chip delivers unprecedented graphics performance for gaming, allowing device makers to pair it with the fastest FullHD+ displays for an immersive and responsive experience. Alternatively, it supports an impressive 144Hz refresh rate at WQHD+ resolution for even sharper visuals.
11. MediaTek Intelligent Display Sync 2.0
Intelligent Display Sync 2.0 optimizes power efficiency by utilizing higher refresh rates only when necessary. It ensures a seamless viewing experience in intense action scenarios while conserving battery during less demanding activities. The technology minimizes inter-frame latency by optimizing GPU-to-display synchronization, giving gamers a competitive edge in reaction times.
12. Wi-Fi Display Up to 4K60 HDR10+
The Dimensity 9000 enhances wireless streaming by enabling 4K60 HDR10+ content delivery to compatible SmartTVs, eliminating the hassle of cables and low-resolution streaming.
13. 3GPP Release-16 5G Smartphone Modem
MediaTek is the first to launch a 3GPP Release-16 standard 5G modem, starting with the Dimensity 9000. This ensures future-proof 5G connectivity.
14. Maximized Sub-6GHz Performance
With a peak downlink performance of 7Gbps, the Dimensity 9000 sets new benchmarks in sub-6GHz 5G connectivity. Its advanced 3CC Carrier Aggregation (300MHz) modem enhances both peak and average performance, particularly in markets with fragmented or narrowband 5G availability.
15. Multimode Dual SIM Dual Active
MediaTek continues to lead in dual SIM technology, introducing Multimode Dual SIM Dual Active, which allows simultaneous 5G and 4G connections for enhanced multitasking and productivity.
16. World’s First R16 Uplink Enhancement
The Dimensity 9000 is the first smartphone chip to support 3GPP Release-16 uplink enhancements, including "Super Upload" (SUL) and 5G-NR uplinks with carrier aggregation, significantly boosting upload performance.
17. Wi-Fi 6E 2x2 (BW160)
With support for the 6GHz band and 160MHz bandwidth, the Dimensity 9000 delivers unparalleled Wi-Fi throughput and efficiency in a smartphone chip.
18. World’s First Bluetooth 5.3 Support in Smartphones
The Dimensity 9000 supports Bluetooth 5.3, which introduces new security features and low-latency connectivity, making it ideal for wireless headsets and other peripherals.
19. New Beidou III-B1C GNSS Support
The Dimensity 9000 incorporates support for the latest Beidou GNSS system, delivering next-generation satellite navigation accuracy for Chinese users.
