Revolutionize Your World with MediaTek ASIC
Precision Engineering for High Performance, Security, and Efficiency.
MediaTek ASIC delivers custom-designed chips tailored for modern applications—from high-performance cloud infrastructures to innovative consumer devices. Leveraging advanced Arm Neoverse CPUs, cutting-edge interconnects, and an extensive IP portfolio, our solutions enhance speed, reliability, and security across a range of use cases.
Our comprehensive portfolio includes breakthrough technologies like our 224G SerDes, exemplifying our commitment to high-speed data transmission and robust performance in demanding networking environments—integrated seamlessly with our broader ASIC capabilities.
From feasibility studies to manufacturing and global logistics, MediaTek ASIC offers an end-to-end, custom-made approach that empowers your business to achieve superior performance and efficiency.
High-Performance, Secure, and Scalable for Data Centers
Cloud ASIC Solutions
Ultra-fast processing, robust security, and seamless scalability.
Breakthrough Speed
- Advanced Arm Neoverse CPU for extreme data throughput.
- High-speed interconnects minimize latency.
- Ideal for mission-critical workloads.
Ironclad Protection
- Custom cryptographic IP with built-in encryption.
- Cyber-resilient architecture for secure boot.
- Trusted execution environments for data integrity.
Growth Without Limits
- Global foundry and packaging partnerships.
- Scalable design from hundreds to millions of units.
- Adaptable to evolving enterprise demands.
Complete Cloud Journey
- Integrated process from feasibility to production.
- Dedicated technical support at every stage.
- Flexible engagement for multi-cloud or hybrid solutions.
Innovative, Energy-Efficient, and Connected for Next-Gen Devices.
Consumer ASIC Solutions
Immersive multimedia, smart power design, and custom innovation.
Visual & Audio Brilliance
- High-performance multimedia acceleration for stunning visuals.
- Advanced wireless connectivity (Wi-Fi, 5G, Bluetooth).
- Real-time rendering for seamless streaming and gaming.
Power Smart
- Optimized for battery-powered devices.
- Innovative 2D/2.5D/3D packaging for compact design.
- Extended device runtime without sacrificing performance.
Tailor-Made Innovation
- Extensive IP portfolio for specialized features.
- Personalized performance aligned with brand needs.
- Stand out in a competitive consumer market.
Unified Consumer Experience
- Integrated multimedia, connectivity, and packaging solutions.
- Smooth interoperability across devices and ecosystems.
- Accelerated time-to-market with proven design expertise.
Cutting-Edge. Custom Made.
224G SerDes (Cloud)
Reaffirming our commitment to your ASIC and data center needs with 224G SerDes expertise.
224G SerDes & Beyond
- Production-ready 224G SerDes solutions setting new industry standards.
- Actively developing 448G SerDes to meet future demands.
- Tailored for AI, hyperscale, data center, and networking companies.
Advanced Process Nodes with DTCO
- Collaboration with major foundry service providers in advanced process nodes.
- Enables better PPA through Design
Technology Co-Optimization (DTCO). - Over 70 product tape-outs from 7nm to 2nm; first N2P TO in 2025.
Advanced Packaging
- Significant experience in large-size packaging including CoWoS and InFO processes.
- First InFO product MP in 2021 with the world's largest 91x91 mm² package (1+8 chiplets).
- First CoWoS product MP in 2022 with the world's largest 85x85 mm² package with HBMs; enabling larger package sizes (~8-9x reticle).
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Memory (HBM & DRAM) Readiness
- Extensive expertise in HBM2/2E and HBM3/3E technologies.
- In-house development of HBM 4/4e, custom HBM4E, and LPDDR5 with customized libraries.
- Optimized for enhanced performance and efficiency.
Interconnects (Except SerDes)
- In-house development of high-speed I/Os including Mlink, UCle, and PCIe Gen7.
- Customized libraries deliver better PPA.
- Co-packaged optical platforms featuring CPO, LPO, and HRO technologies.
Gain the Advantage
- Experience cutting-edge 224G SerDes technology that transforms data centers.
- Custom-made solutions delivering unmatched speed, efficiency, and reliability.
- Empower your business with next-gen ASIC innovation tailored to your needs.
Key Features
Feasibility Study
Collaborate to assess performance, power, cost, and time-to-market.Define the scope and feasibility of your custom ASIC solution.
Project Launch
Assist with platform design for wide-scale integration.Set specifications to ready your portfolio for next-gen ASIC.
Logistics and Volume
Leverage global shipping and third party suppliers.Secure reliable, business-scale supply channels for ASIC.
Development
Work with industry-leading teams to design and develop your ASIC.Utilize advanced simulation tools to ensure first-silicon success.
Manufacture, Test, Assembly, Package
Optimize fabrication with top foundry partnerships and advanced packaging (2.5D/3D).Test, assemble, and package at scale for consistent quality.
Longevity & Support
Provide ongoing support throughout the product lifecycle.Ensure timely delivery while meeting sustainability targets.
Quality Assurance
Rigorously validate performance and reliability across production.Implement continuous testing to maintain high standards.
Post-Launch Optimization
Analyze real-world performance data to fine-tune processes.Implement improvements to maximize efficiency and scalability.
Feasibility Study
Collaborate to understand your idea, focusing on high performance in power-constrained environments.Address unique use cases and operational challenges.
Development
Our world-class engineers design and develop your ASIC to specification.Expert support reduces time-to-market and ensures top-quality performance.
Packaging
Support for monolithic SoC, MCM, or SiP using 2D, 2.5D, or 3D packaging technologies.Enable cutting-edge, compact designs that maximize device efficiency.
Development
Build ASIC solutions for long-term reliability and durability.Avoid costly redesigns with comprehensive, ongoing support.
Project Launch
Specify the solution by integrating MediaTek and third-party IP elements.Establish the design foundation for a custom, market-ready chip.
Manufacturing
Leverage extensive partnerships with top foundries and suppliers.Ensure high-quality fabrication that meets your preferred process requirements.
Logistics
Utilize global business-scale shipping for dependable delivery.Secure robust supply channels to support production needs.
Post-Launch Optimization
Gather performance insights and user feedback to refine device functionality.Continuously optimize design and process for enhanced product quality.
Committed to a Sustainable Future
Optimizing power efficiency is at the core of our design philosophy, enabling us to deliver more environmentally friendly solutions. With MediaTek’s suite of power savings technologies, we ensure maximum performance per watt for various workloads and applications.
Committed to a Sustainable Future
Optimizing power efficiency is at the core of our design philosophy, enabling us to deliver more environmentally friendly solutions. With MediaTek’s suite of power savings technologies, we ensure maximum performance per watt for various workloads and applications.
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