Press Room
世界初スマートフォンサイズのNOMA対応チップセットによる 周波数利用の効率化実験に成功
2017年11月2日
株式会社ＮＴＴドコモ（以下、ドコモ）と、MediaTek Inc．(以下、 MediaTek）は、第５世代移動通信方式（以下、5G）の時代に活躍が期待される、周波数の利用効率を向上させる技術「非直交多元接続方式※１」（以下、NOMA）と、NOMAの実現に必要な技術「マルチユーザ干渉キャンセル※２ 」（以下、MUIC）を実装したチップセット（以下、同チップセット）の仕様検討と開発を行い、同チップセットを搭載した現行スマートフォンサイズの端末による実証実験を行った結果、従来技術と比較して最大2.3倍となる周波数利用効率の向上を確認しました。
MediaTek 日本でのNB-IoT普及、促進に向けて相互接続性試験をソフトバンクと実施
2017年10月3日
MediaTek Inc. (本社：台湾新竹市、日本法人：メディアテックジャパン株式会社、以下：MediaTek)は、ソフトバンク株式会社と、IoT機器向けのLTE規格であるNB-IoT（NarrowBand-IoT）の相互接続性試験を2018年第1四半期より順次実施し、NB-IoTの商用サービスの提供に向けた取り組みを推進していきます。MediaTekは、今回の取り組みを通じて、自社のNB-IoTテクノロジーの進化を図ると共に、NB-IoTのグローバル展開に向けた取り組みを進めていきます。
Full-Featured MediaTek Smartphone Chipset MT6739 Debuts in India
2017年9月27日
New Delhi, September 27, 2017－MediaTek Inc., the Taiwan-based global fabless semi-conductor leader, introduced its MT6739 chipset today at India Mobile Congress 2017, the first mobile conference of its kind in the region. The high-speed quad-core System on Chip (SoC) is built for India’s rapidly growing 4G market. The MT6739 features an advanced WorldMode LTE Cat.4 modem, dual camera photography...
New MediaTek Helio Chipsets Deliver Rich Features to Booming Mid-Range Market
2017年8月29日
HSINCHU, Taiwan – August 29, 2017 — MediaTek Inc. today introduced the newest members of the Helio chipset family, the Helio P23 and Helio P30 system-on-chips (SoCs). The new chipsets, designed to deliver performance and power efficiency, dual camera photography, dual SIM and dual 4G VoLTE capabilities, support the explosion of innovation in the mid market.
MediaTek Unveils its First NB-IoT SoC and Announces China Mobile Collaboration to Build Industry’s Smallest NB-IoT Module
2017年6月29日
HSINCHU, Taiwan – June 29, 2017 — MediaTek Inc. today unveiled its first narrow band Internet of Things (NB-IoT) System-on-Chip (SoC), the MT2625, and announced a collaboration with China Mobile to build the world’s smallest NB-IoT module (16mm X 18mm) around the chipset. MediaTek’s new ultra-low-power MT2625 SoC supports a full frequency band(from 450MHz to 2.1GHz) of 3GPP R13 (NB1) and R14...
MediaTek Launches Dual 4G VoLTE Solution with China Mobile
2017年6月27日
HSINCHU, Taiwan – June 27, 2017— MediaTek Inc. today announced its Dual 4G VoLTE (Voice over LTE) solution, supporting dual SIM, dual stand-by for VoLTE for China Mobile. MediaTek Helio X30 is the industry’s first chipset to complete the interoperability test of dual 4G VoLTE on the China Mobile network.
MediaTek Announces Ultra HD TV SoC Supporting Dolby Vision and Hybrid Log Gamma (HLG)
2017年6月12日
HSINCHU, Taiwan – June 12, 2017 — MediaTek Inc. today announced the availability of its new MediaTek MT5597 System-on-Chip (SoC), an Ultra HD TV SoC supporting Dolby Vision™ and Hybrid Log Gamma (HLG). MT5597 transforms TV viewing experiences with breakthrough brightness, contrast and color.
MediaTek Opens New Office in Bangalore to Strengthen its India Presence
2017年6月7日
Bengaluru – June 7, 2017 — MediaTek, one of world’s largest fabless semiconductor companies, today announced the opening of its new facility in, Bengaluru, the Silicon Valley of India. The new facility located at RMZ Eco World in Marathahalli will provide R&D, sales and marketing support to MediaTek India.
MediaTek Announces Dr. Lih Shyng (Rick) Tsai Officially Takes the Office of Co-CEO on 1 June 2017
2017年6月1日
HSINCHU, Taiwan – June 1, 2017 — MediaTek today announced that Dr. Lih Shyng (Rick) Tsai officially takes the office of Co-CEO on 1 June 2017, and reports directly to Chairman and Chief Executive Officer, Ming-Kai Tsai.
MediaTek Launches Next Generation Wi-Fi Chipset Portfolio for IoT to Enhance Smart Home and Office Devices
2017年5月31日
HSINCHU, Taiwan – May 31, 2017 — MediaTek Inc. today announced its next generation Wi-Fi chipset portfolio, custom built to drive innovation and performance for connected smart home and office device makers. The MediaTek MT7686, MT7682, and MT5932 will deliver high levels of integration with low power consumption for applications such as home appliances, home automation, smart gadgets, and IoT...
MediaTek Launches MT7622, World’s First 4x4 802.11n/Bluetooth 5.0 System-on-Chip with Dedicated Network Accelerator
2017年5月30日
HSINCHU, Taiwan – May 30, 2017 — MediaTek Inc. today introduced the world’s first 4x4 802.11n and Bluetooth 5.0 system-on-chip featuring a dedicated Wi-Fi network accelerator. The MediaTek MT7622 was created for premium networking devices including routers and repeaters, whole home Wi-Fi, and home automation gateways that pre-integrate s audio and storage features.
MediaTek Launches MT8516 Chipset Supporting the Google Assistant and Android Things
2017年5月17日
HSINCHU, Taiwan – May 17, 2017 — MediaTek Inc. today introduced its newest full-featured chipset designed to enable Voice Assistant Devices (VADs) and smart speakers, including the Google Assistant. MediaTek also announced support for MT8516 based Android Things pre-certified system on modules (SOMs) at Google I/O.
Rohde & Schwarz and MediaTek announce collaboration on Test Concepts for 5G Wireless Communication Technologies
2017年2月28日
Munich, Germany / Hsinchu City, Taiwan / Barcelona, Spain, February, 28, 2017 — The purpose of the cooperation is to be strategic partners in driving 5G developments in several areas including mm-Waves for 5G radio access and over-the-air (OTA) testing concepts for massive MIMO antenna arrays.
MediaTek and Nokia Collaborate to Enable First Wave of 5G Networks and Devices
2017年2月27日
BARCELONA, Spain – February 27, 2017 – MediaTek and Nokia today announced plans to collaborate on the design of a next-generation mobile communication system for 5G technology. The partnership bridges MediaTek’s broad customer base for connected devices with Nokia’s network expertise, to bring to market a 5G-ready ecosystem for network operators and end users.
MediaTek Unveils Helio X30 to Power Premium Mobile Experiences
2017年2月27日
BARCELONA, Spain – February 27, 2017 – Today at Mobile World Congress, MediaTek Inc. announced the commercial availability of its MediaTek Helio X30 system-on-chip (SoC), the most powerful addition to the Helio family for today’s high-end smartphones. MediaTek Helio X30 is entering mass production and gaining accolades with design wins. Smartphones powered by this flagship chipset will be...
MediaTek Announces CorePilot 4.0 Technology to Deliver Ultimate Processing Power and Power Efficiency to Smartphones
2017年2月27日
BARCELONA, Spain – February 27, 2017 – MediaTek today announced CorePilot 4.0, an advanced technology that intelligently manages smartphone tasks to deliver the perfect balance of processing power and battery life. CorePilot 4.0 is available on MediaTek’s newest SoC, the MediaTek Helio X30. CorePilot 4.0 can deliver up to 25 percent more power savings over the previous version which means end...
MediaTek Smartphone Design Training Program Concludes Successfully
2017年1月16日
NEW DELHI, India – January 16, 2017 – MediaTek Inc. today announced its “Smartphone Design Training Program” created to accelerate the “Make in India” initiative has concluded successfully. MediaTek has developed this training program to foster and educate talent for India’s fast-growing handset industry, by sharing its smartphone expertise and knowledge with a group of handpicked senior managers...
MediaTek Announces the MT2533D Chipset with Advanced Technology for Smart Headsets, Headphones and Hands-Free Systems
2017年1月4日
Las Vegas, NV – January 4, 2017 – MediaTek today announced the availability of MT2533D, a highly integrated chipset for smart, connected headphones, headsets, earpieces and hands-free systems.
BT and MediaTek Collaborate to Deliver Total Wireless Connectivity for the Home, and Connected World
2017年1月4日
Las Vegas, NV – January 4, 2017 – MediaTek today announced that BT has selected MediaTek’s Adaptive Network technology to power their Whole Home Wi-Fi solution, delivering full-coverage wireless connectivity that’s simple to set up and guarantees a stable signal throughout the home. The announcement, made at the 2017 Consumer Electronics Show (CES) demonstrates the role that both BT and MediaTek...
