MediaTek Filogic 360

MediaTek Filogic 360 brings Wi-Fi 7 connectivity to even more high-performance tablets, laptops, PCs, wearables, and other devices. This single-chip Wi-Fi 7 and dual Bluetooth 5.4 client combo solution with single-chip MLO and advanced technologies delivers supreme performance, especially in busy network neighborhoods, and better long-range coverage than previous generations.

Best-in-class Performance and Coverage

The Filogic 360 offers the best-in-class RF performance (Tx and Rx) among 160MHz bandwidth-grade Wi-Fi notebook solutions. Support for triple-band, selectable operation offers peak Wi-Fi 7 speeds of up to 2.9 Gbps. The advanced all-in-one chip includes the latest Wi-Fi 7 technologies such as 4096-QAM, MLO, and MRU.

In busy network environments that experience channel interference, up to 185% greater performance can be achieved versus previous generation Wi-Fi thanks to new Wi-Fi 7 MRU and Preamble Puncture technologies.

Hybrid MLO provides always-on connectivity with best-in-class throughput in short-range connections (up to 1.8Gbps more) and better long-range coverage (up to 10dB better) by adaptively and seamlessly switching between the three available bands in a single chip.

Dual Bluetooth 5.4 with Effective Coexistence Technology

Bluetooth 5.4 connectivity supports Bluetooth LE audio in Windows and Chromebook devices for wireless headsets and earbuds, ensuring reliable stereo audio with the best quality and lowest latency. A dedicated in-chip DSP can perform LC3 decoding via I2S.

MediaTek’s advanced Bluetooth/Wi-Fi coexistence technology ensures both technologies can operate on the 2.4 GHz band seamlessly, without interference.



IEEE 802.11

Wi-Fi 7 (a/b/g/n/ac/ax/be)

Wi-Fi Frequency

2.4GHz, 5GHz, 6GHz


2x2 triple-band

Max Throughput

Up to 2.9Gbps

Wi-Fi 7 Features

  • Wi-Fi 7: 2x2
  • up to 160MHz BW
  • 4096-QAM
  • MLO (eMLSR)
  • MRU



Dual 5.4, LE Audio

Bluetooth Features

  • Bluetooth 5.4: LE Audio
  • MediaTek Bluetooth and Wi-Fi coexistence technology


Single chip with RF, Baseband, MAC, iFEM



PCI-Express 2.1 or USB 3.0