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      MediaTek
      Genio 350

      Entry IoT Platform with Balanced Performance

      Genio_350_mob
      Genio_350

      Overview

      The MediaTek Genio 350 is a highly integrated edge IoT platform featuring a quad-core processor with 4x Arm® Cortex®-A53 cores, built on advanced 14nm process technology. It is designed for embedded systems that require a balance of multimedia support, efficiency, and versatility across industries such as industrial automation, low-power IoT and enterprise devices, access control solutions, and smart home applications.

      With OS support for Android, Yocto Linux, and Ubuntu, the Genio 350 provides developers with the flexibility to create scalable, high-performance IoT and intelligent embedded solutions.

      Key Features

      High Performance

      Capable Quad-core CPU

      4x Arm Cortex-A53 @ 2.0 GHz,
      for seamless, robust processing.

      AI & Visual Processing_Icon-1

      VPU for Vision Processing

      Integrated VPU for visual processing and dedicated audio DSP, ideal for facial and audio recognition with fast response.

      High-Resolution Display Support

      High-Resolution Display Support

      FHD+ resolution with dual-display capability, ensures immersive visual experiences.

      Enhanced Camera Capabilities_Icon-1

      Enhanced Camera Capabilities

      Internal ISP supporting: 13MP @ 30fps,
      2x MIPI CSI-2 4-Lane,
      Dual camera framework.

      Operating Systems_Icon-1

      Multiple Operating Systems

      Support Android, Yocto Linux and Ubuntu.

      Product Specification

      Process

      Process

      14nm

      Processor

      Processor (CPU)

      4x Arm Cortex-A53, 2.0 GHz

      Graphics Processor (GPU)

      Arm Mali-G52, 800 MHz

      Neural Processing Unit (NPU)

      0.35 TOPS

      1x Cadence Tensilica Vision 6 DSP (VP6)

      Audio DSP

      Cadence Tensilica HiFi 4 DSP

      Memory and Storage

      Memory and Type

      x32 LP3-1600  (up to 4 GB)

      x32 LP4X-3200 (up to 4 GB)

      Storage Type

      eMMC 5.1

      SD 3.0

      SPI-NAND

      Multimedia

      Display Interface

      1x MIPI-DSI  (4L, 1.2Gbps/L)

      1x DPI / 1x LVDS

      Display Controller

      Dual Display, Max FHD+HD

      Single Display, Max FHD

      (Support PQ)

      Video-in Interfaces

      2x MIPI CSI-2 (4L, 1.5 Gbps/L)

      (Virtual Channel: 4x)

      Image Signal Processor

      1x ISP, 13MP @ 30fps

      (3A, NR, AI-FD, LSC, Warp Engine)

      Video Decode

      MPEG4/H.264/H.265 (FHD60)

      Video Encode

      H.264/H.265 (FHD60)

      Interfaces

      USB

      1x USB 2.0 (Host)

      1x USB 2.0 (Host/Device)

      Ethernet

      10/100 Ethernet MAC

      PCIe

      N/A

      UART

      3x UART

      I2C

      4x I2C

      SPI

      1x SPI Master

      PWM

      3x PWM

      I2S/TDM

      2x 12S input, 2x I2S output

      1x TDM input, 1x TDM output

      PDM

      4x PDM input

      PCM

      1x PCM input/output

      SPDIF

      1x SPDIF input, 1x SPDIF output

      Temperature support

      Temperature

      -20°C to 105°C (Tj)

      Package Information

      Package Type

      VFBGA

      Package Dimensions

      12.2 x 11.8 x 0.9 mm, 0.4 mm ball pitch

      Wireless Connectivity

      Integrated Wi-Fi Baseband

      Wi-Fi 5 1x1 / BT 5.0 (MT6631)

      Security

      Security

      ARM TrustZone
      Security Boot (RSA3072)
      Crypto Engine
      RNG