
Press Room
TSMC and MediaTek Demonstrate First Integrated PMU and PA for Wireless Connectivity Products on N6RF+ Process Technology
Mar 12, 2025 - 02:00 PM
HSINCHU, Taiwan, R.O.C. Mar. 12, 2025 - MediaTek and TSMC (TWSE: 2330, NYSE: TSM) announced today that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
MediaTek Expands Cloud-to-Edge Leadership with Next-Generation Connectivity and AI at MWC 2025
Feb 27, 2025 - 07:00 AM
BARCELONA, Spain – February 27, 2025 – At Mobile World Congress 2025, MediaTek is showcasing several key technologies that enable wireless evolution towards 6G, including hybrid computing, a live LEO broadband NR-NTN trial, sub-band full duplex (SBFD), along with the new M90 5G Advanced modem. In addition, the company is also sharing its latest developments in Dimensity Auto and Dimensity...