Press Room
MediaTek Unveils the Dimensity 8400, the First All Big Core Chip for Premium Smartphones
23 Dec 2024 - 03:30
HSINCHU, Taiwan – Dec. 23, 2024– MediaTek today announced the Dimensity 8400, a premium smartphone chip offering the most powerful Gen-AI performance in its class. Building on the legacy of the flagship Dimensity 9400, the MediaTek Dimensity 8400 brings an All Big Core design to the premium smartphone market for the first time. The All Big Core CPU is paired with a powerful NPU to accelerate...
MediaTek Demonstrates Long Reach 224G SerDes for High-Performance ASIC Designs at 2024 OCP Global Summit | MediaTek
14 Oct 2024 - 11:00
San Jose, CA – Oct. 14, 2024– At the OCP Global Summit, MediaTek, an industry leader in ASIC with more than 1 billion units shipped and over 70 product tape-outs, will demonstrate its silicon proven long reach 224G SerDes. This marks a significant leap forward in performance, reliability, and efficiency for the highest-performance ASIC applications. The 224G SerDes extends MediaTek’s portfolio,...
MediaTek’s Dimensity 9400 Flagship SoC Offers Extreme Performance and Efficiency for the Latest AI Experiences
09 Oct 2024 - 11:30
HSINCHU, Taiwan – Oct. 9, 2024– MediaTek today launched the Dimensity 9400, the company’s new flagship smartphone chipset optimized for edge-AI applications, immersive gaming, incredible photography, and more. The Dimensity 9400, the fourth and latest in MediaTek’s flagship mobile SoC lineup, offers a massive boost in performance with its second-generation All Big Core design built on Arm’s v9.2...
MediaTek Integrates NVIDIA TAO ToolKit with NeuroPilot SDK for Accelerated Development of Edge AI Applications in IoT
05 Jun 2024 - 16:30
TAIPEI, Taiwan – June 5, 2024 – At COMPUTEX 2024, MediaTek announced it will integrate NVIDIA TAO with MediaTek’s NeuroPilot SDK, part of its edge inference silicon roadmap. MediaTek’s support for NVIDIA TAO will create a seamless experience for developers as they bring edge AI (including Generative AI) capabilities to a wide variety of IoT applications powered by MediaTek’s cutting-edge silicon....
MediaTek Joins Arm Total Design to Shape the Future of AI Computing
04 Jun 2024 - 14:00
TAIPEI, Taiwan – June 4, 2024 – MediaTek announced today at COMPUTEX 2024 that the company has joined Arm Total Design, a fast-growing ecosystem that aims to accelerate and simplify the development of products based on Arm® Neoverse™ Compute Subsystems (CSS). Arm Neoverse CSS is designed to meet the performance and efficiency needs of AI applications in the data center, infrastructure systems,...
MediaTek to Unveil Products for Chromebooks, Smart TVs and Displays at COMPUTEX 2024, Highlighting Demonstrations in AI Processing
04 Jun 2024 - 09:00
HSINCHU, Taiwan – Jun 04, 2024 – At COMPUTEX 2024, MediaTek will showcase new products and technology demonstrations, featuring highlights in AI, Smart TVs, Chromebooks, IoT and more, in addition to a keynote by Vice Chairman and CEO Dr. Rick Tsai about how MediaTek can enable ubiquitous AI.
MediaTek’s Dimensity 7300 Chips Level Up AI and Mobile Gaming for High-Tech Smartphones and Foldables
30 May 2024 - 09:00
HSINCHU, Taiwan – May 30, 2024 – MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of ultra-efficient 4nm chips for high-tech mobile offerings. Providing best-in-class power efficiency and excellent performance, the Dimensity 7300 chipsets enable effortless multitasking, superior photography, accelerated gaming, and AI-enhanced computing; additionally, the Dimensity...
MediaTek Boosts Flagship Smartphone Performance with Dimensity 9300+ SoC
07 May 2024 - 10:00
HSINCHU, Taiwan – May 7, 2024 – MediaTek today unveiled the Dimensity 9300+, the latest flagship mobile chip in MediaTek’s Dimensity portfolio. The Dimensity 9300+ offers increased clock speeds and is designed to accelerate on-device generative AI processing, offering broader support for LLMs, and other performance enhancements over the Dimensity 9300.
MediaTek launches next-generation ASIC design platform with co-packaged optics solutions at OFC 2024
20 Mar 2024 - 14:00
San Diego, CA – March 20, 2024 – Ahead of the 2024 Optical Fiber Communication Conference (OFC), MediaTek today announced it is launching a next-generation custom ASIC design platform that includes the heterogeneous integration of both high-speed electrical and optical I/Os in the same ASIC implementation. MediaTek will be demonstrating a serviceable socketed implementation that combines 8x800G...
MediaTek Brings Advanced AI Capabilities to Vehicles with New Dimensity Auto Cockpit Chipsets Enabled By NVIDIA Technology
18 Mar 2024 - 06:00
San Jose, Calif. – March 18, 2024 – MediaTek announced today at NVIDIA GTC four new automotive SoCs (systems-on-chip) within its Dimensity Auto Cockpit portfolio, offering powerful AI in-cabin experiences for the next generation of intelligent vehicles. MediaTek’s Dimensity Auto Cockpit C-X1, C-Y1, C-M1, and C-V1 will come with support for NVIDIA DRIVE OS, allowing automakers to leverage the...
MediaTek Research introduces Breeze-7B open-source Large Language Model
07 Mar 2024 - 14:00
HSINCHU, Taiwan – March 7, 2024 – MediaTek Research, a cutting-edge research arm of MediaTek, announced it is releasing a new open-source Large Language Model (LLM) called MediaTek Research Breeze-7B (MR Breeze-7B). This LLM is adept in Traditional Chinese and English, and comes on the heels of their pioneering traditional Chinese language model in early 2023. MR Breeze-7B, boasting 7 billion...
MediaTek Unveils T300 5G RedCap Platform for IoT and Extremely Low Power Devices
26 Feb 2024 - 14:00
BARCELONA, Spain – February 26, 2024 – At MWC 2024, MediaTek today announced the latest addition to its 5G RedCap portfolio, the MediaTek T300 platform for IoT applications. The T300 is a 5G RedCap RF-system-on-chip (SoC) built with MediaTek’s M60 modem, which supports the 3GPP Release-17 standard to offer significant generational advantages over existing 4G IoT solutions.
MediaTek to showcase series of Generative AI industry-firsts for smartphones at MWC 2024
21 Feb 2024 - 14:00
BARCELONA, Spain – February 21, 2024– MediaTek, a leading global fabless semiconductor powering more than two billion connected edge devices every year, is showcasing a series of new Generative AI demonstrations at Mobile World Congress 2024, all of which are utilizing the latest generation of APU hardware featured in the Dimensity 9300 flagship smartphone SoC. These live exhibitions will...
MediaTek to Spotlight Next-Gen Satellite Broadband, Video Generative AI, and 6G Ambient Computing Demonstrations at MWC 2024
21 Feb 2024 - 07:00
BARCELONA, Spain – February 21, 2024 – At MWC 2024, MediaTek will showcase several technology demonstrations, featuring next-generation product highlights in NTN, 5G RedCap, and 5G CPE, plus collaborations in Dimensity Auto, as well as novel examples of real-time Generative AI video diffusion and pre-6G ambient computing. MediaTek-powered devices from some of the world’s biggest brands will also...
MediaTek announces the first wave of Wi-Fi Alliance® Wi-Fi CERTIFIED 7™ Products
08 Jan 2024 - 10:00
LAS VEGAS, Nevada – January 8, 2024 – MediaTek, one of the first adopters of Wi-Fi 7 technology, today announced that it is working closely within Wi-Fi Alliance to launch a complete first wave of Wi-Fi CERTIFIED 7™ products, which will be featured as part of MediaTek’s global ecosystem showcase at CES 2024. In an era where people rely on artificial intelligence to improve their lives and...
MediaTek AI-Super Resolution to improve streaming content on Hisense smart TVs
04 Jan 2024 - 09:00
HSINCHU, Taiwan – January 4, 2024 – MediaTek today is expanding its longstanding relationship with Hisense, the first television brand to utilize Pentonic SoCs, to significantly improve the visual quality of streaming content. Starting in 2024, MediaTek AI-Super Resolution (AI-SR) technology will be integrated and supported across Hisense’s full lineup of smart TVs.
