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      MediaTek Dimensity
      Flagship 5G Family

      MediaTek Dimensity 7030

      An immensely power efficient chipset that offers best of 5G speeds with brilliant gaming technology that delivers professional grade imaging and videography to advanced AI and latest computing architecture.

      Seamless 5G Experiences

      Seamless 5G sub-6GHz & mmWave Connectivity

      Benefit from a truly seamless 5G experience that fluidly switches between long-reach sub-6GHz and superfast mmWave connections. The Dimensity 7030 can connect to both FR1+FR2 simultaneously, providing up to 53% faster speeds (up to 5.5Gbps) versus competitor platforms that can only connect to 4G LTE and mmWave simultaneously.

      Industry-Leading Dual 5G SIM Technologies

      The Dimensity 7030 continues MediaTek’s dual SIM industry leadership with support for Dual 5G SA with both embedded and physical SIM, giving users more choice of powerful 5G experiences, and the opportunity for VoNR to provide the best quality voice and video call experience from both SIM connections.

      • Dual 5G SA, Dual VoNR
      • DSDS with FR2 support
      • Global DSDS pSIM+eSIM support
      • Google Wireless Fi dual SIM support

      Additional Key Features

      Faster Speeds with 3CC Carrier Aggregation (CA)

      In sub-6GHz exclusive domains, the Dimensity 7030 supports the latest 3CC-CA for faster effective speeds of up to 4.6Gbps, greater reach and handover in a coverage area, and includes validated support for 3CC combinations of US cellular operator bands.

      Faster Sub-6GHz Uplink Speeds

      Support for 2CC-CA uplink in sub-6GHz is ready for US carrier deployment. Using CA uplink improves speeds by up to 67% in urban environments (TDD+FDD) and can double performance in suburban areas (FDD+FDD).

      Exclusive MediaTek FAR mmWave technology

      MediaTek's exclusive Fast, Accurate, Robust (FAR) Beam Technology empowers mmWave (FR2) connections with greater effective performance and connection reliability when moving and where connections are non-line of sight.

      • +47% average throughput gain in non-line of sight with a moving device
      • +21% average throughput gain in non-line of sight from multiple signals
      • +3% average throughput gain in line of sight with a rotating device

      The Dimensity 7030 supports Full HD+ displays with super-fast 144Hz refresh rates. High-speed displays provide notably smoother everyday experiences like scrolling and animations in apps. MediaTek Intelligent Display Sync technology improves the power efficiency by dynamically adjusting the refresh rate to only enable faster speeds when it’s needed most.

      Native 10-bit color gives vibrant HDR experiences from a billion-color palette. Support for the latest global HDR video content standards includes HDR10+ Adaptive, HLG and Dolby Vision.

      The dual HDR video capture engine can record using two cameras simultaneously, giving users unique streaming/videography opportunities to record selfie + environment, or different frames of the same view, such as wide + zoom together, never missing a moment.

      Device makers can build smartphones with a main camera up to 108MP, while also making use of the highly capable MediaTek NPU 550 to apply class-leading AI-noise reduction techniques for superior low-light photos.

      The multi-core MediaTek NPU 550 includes a multi-tasking scheduler that ensures concurrent AI-tasks are efficiently processed with low latency and minimal power consumption. The NPU 550 can natively process standard INT8/16 instructions, as well as FP16 in precision-focused tasks.

      MediaTek HyperEngine 5.0 makes smarter use of CPU and GPU resources, offers exclusive AI-based Variable Rate Shading (AI-VRS), and MediaTek Intelligent Display Sync to collectively improve power efficiency while gaming. Meanwhile, Wi-Fi and 5G optimizations ensure lower-latency network connections to the game server.

      Superfast Wi-Fi 6E (2x2 MIMO) is built right into the chip, giving the Dimensity 7030 superior power efficiency compared to competitor platforms use of external Wi-Fi chip solutions. Using new tri-band connectivity (2.4GHz, 5GHz, 6GHz) gives users faster, lower-latency network connections.

      Using the advanced TSMC N6 (6nm-class) production process means the Dimensity 7030 is exceptionally light on power, extending battery life even for the most demanding smartphone users.

      Specifications

      Processor

      CPU

      • Arm Cortex-A78 @ 2.5GHz
      • Arm Cortex-A55 @ 2.0GHz

      Cores

      Octa (8)

      CPU Bit

      64-bit

      Heterogeneous Multi-Processing

      Yes

      Memory & Storage

      Memory Type

      • LPDDR5
      • LPDDR4x

      Storage Type

      • UFS 3.1
      • UFS 2.1

      Connectivity

      Cellular Technologies

      Sub-6GHz (FR1), mmWave (FR2), 2G-5G Multi-Mode, 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM

      Specific Functions

      SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, FR1 TDD+FDD, DSS, FR1 DL 3CC up to 200 MHz, FR1 UL 2CC up to 100MHz, FR2 DL 4CC up to 400MHz + MediaTek FAR mmWave technology, FR1+FR2: 100MHz+400MHz, 256QAM FR1 UL 2CC, 256QAM VoNR / EPS fallback.

      GNSS

      • GPS L1CA+L5
      • BeiDou B1I+ B2a
      • Glonass L1OF
      • Galileo E1 + E5a
      • QZSS L1CA+ L5
      • NavIC

      Wi-Fi Antenna

      2T2R

      Wi-Fi

      Wi-Fi 6E (a/b/g/n/ac/ax)

      Bluetooth

      5.2

      Display

      Max Display Resolution

      2520 x 1080

      Max Refresh Rate

      144Hz

      AI

      AI Accelerator

      MediaTek NPU 550

      Graphics

      GPU Type

      Arm Mali-G610 MC3

      Video Encoding

      • H.265 / HEVC
      • H.264

      Video Encoding FPS

      4K @ 30FPS

      Video Playback

      • H.265 / HEVC
      • H.264
      • MPEG-1/2/4
      • VP-9

      Video Playback FPS

      4K @ 30FPS

      Camera

      Max Camera ISP

      • 108MP
      • 20MP + 20MP

      Max Video Capture Resolution

      3840 x 2160

      Camera Features

      • Dual HDR video capture hardware
      • 3X HDR-ISP
      • MFNR
      • 3DNR
      • AINR
      • Hardware Depth Engine
      • Warping Engine