MediaTek Insights

A MediaTek team has received the ISSCC 2025 Anantha P.Chandrakasan Distinguished Technical Paper Award for its paper presenting a 212.5Gb/s DSP-based PAM4 transceiver fabricated using TSMC 4nm FinFET technology.

In a recent conversation with SixFive Media, hosts Patrick Moorhead and Daniel Newman sat down with MediaTek's Shahar Noy, AVP of Data Center Solutions, and Rahul Sandil, VP and GM of Global Corporate Marcom, to explore the company's expanding influence in custom silicon and AI innovation,

This week at Computex 2025, our Vice Chairman and CEO, Rick Tsai, shared details about MediaTek’s partnership with NVIDIA to bring leading-edge AI solutions to the forefront of technology. As one of the first adopters of NVIDIA NVLink Fusion, MediaTek is leveraging its expertise in ASIC design and...

MediaTek's latest technology breakthrough is 224G SerDes for Datacenter-grade ASICs. This silicon-ready technology provides huge bandwidth for today’s most demanding applications like AI xPUs, hyperscale, and networking infrastructure in enterprise and datacenter.

At ISSCC 2025, MediaTek's wireline connectivity team presented its best-in-class SerDes performance for 212Gb/s, and 106Gb/s using DSP-based PAM-4 transceiver, with channel reach exceeding 50dB for both speeds. The highest shoreline bandwidth density and competitive power was also demonstrated. ...

NVIDIA is collaborating with MediaTek on the design of the NVIDIA GB10 Grace Blackwell Superchip for NVIDIA Project DIGITS, leveraging MediaTek’s expertise in CPU performance and power efficiency. Watch NVIDIA CEO Jensen Huang introduce the collaboration during the CES keynote speech:

With new products and smart technology use cases coming to market, MediaTek tailors its silicon to meet a variety of product needs, including the mainstream and niche product segments. Learn more about MediaTek's approach to customizable silicon, and how it specifically addresses different...

MediaTek is set to impress at the 2024 OCP Global Summit, in San Jose, California, between October 15–17, 2024. We'll be demonstrating our silicon-proven 224G SerDes, allowing attendees to discover how our advanced ASIC technology, capable of 2.5D multichip and UCIe interconnects, is...

MLO, or Multi-Link Operation, is the key technological breakthrough of Wi-Fi 7, delivering a leap in wireless performance by aggregating all three Wi-Fi bands together in smart ways. MediaTek furthers the advantage of MLO through its single-MAC MLO architecture, which is to say all three...