MediaTek Insights

By Jerry Chang, Head of Marketing, Americas & Europe, MediaTek. AI performance is now defined at the server rack, where compute, memory, interconnect, power, and economics converge. Until recently, performance improvements were driven at the chip level. Faster transistors, denser integration, and...

By Jerry Chang, Head of Marketing, Americas & Europe, MediaTek MediaTek's expansion into data center infrastructure represents one of the company's fastest-growing businesses and a key pillar of its strategy to extend AI innovation from the edge to the cloud. At Computex 2026, MediaTek’s...

AI compute demand is now doubling every few months, far faster than traditional scaling strategies can support.

Exploring heterogeneous compute in the data center—how custom ASIC designs help create XPUs to accelerate modern AI workloads. Data Center Insights by Jerry Chang, Sr. Director, Head of Marketing, Americas and Europe.

A MediaTek team has received the ISSCC 2025 Anantha P.Chandrakasan Distinguished Technical Paper Award for its paper presenting a 212.5Gb/s DSP-based PAM4 transceiver fabricated using TSMC 4nm FinFET technology.

Advanced packaging is key to getting better performance and efficiency for AI applications. MediaTek has a long history of collaboration with TSMC, giving us access to the latest process nodes and advanced packaging technologies so we can get more out of each chip. This video explores how...

In a recent conversation with SixFive Media, hosts Patrick Moorhead and Daniel Newman sat down with MediaTek's Shahar Noy, AVP of Data Center Solutions, and Rahul Sandil, VP and GM of Global Corporate Marcom, to explore the company's expanding influence in custom silicon and AI innovation,

This week at Computex 2025, our Vice Chairman and CEO, Rick Tsai, shared details about MediaTek’s partnership with NVIDIA to bring leading-edge AI solutions to the forefront of technology. As one of the first adopters of NVIDIA NVLink Fusion, MediaTek is leveraging its expertise in ASIC design and...

MediaTek's latest technology breakthrough is 224G SerDes for Datacenter-grade ASICs. This silicon-ready technology provides huge bandwidth for today’s most demanding applications like AI xPUs, hyperscale, and networking infrastructure in enterprise and datacenter.

At ISSCC 2025, MediaTek's wireline connectivity team presented its best-in-class SerDes performance for 212Gb/s, and 106Gb/s using DSP-based PAM-4 transceiver, with channel reach exceeding 50dB for both speeds. The highest shoreline bandwidth density and competitive power was also demonstrated. ...