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      MediaTek
      T300

      Incredibly compact and ultra-efficient 5G RedCap IoT platform with integrated RF​

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      Overview

      The MediaTek T300 5G RedCap modem solution offers 3GPP Rel. 17 standard features in addition to unique advantages in industry-leading power-efficiency, enhanced coverage, and reliable connectivity, offering a significant generational advantage over existing 4G solutions for a range of wearables, light-weight AR devices, IoT modules, and edge AI applications.

      5G RedCap will revolutionize connected devices in consumer and enterprise markets. Many wearable and IoT devices are size and power constrained, which requires extremely compact platforms with simplified antenna designs, without impacting connectivity reliability. The MediaTek T300 can deliver excellent connectivity performance while reducing PCB area by integrating the modem baseband and RF into a single SoC.

      Key Features

      Power‐Efficient Architecture-2

      Power-Efficient Architecture

      The T300 with UltraSave technology delivers low power consumption – 60% less compared to 4G/LTE & 70% less than 5G eMMB modem solutions.​

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      Compact Design​

      The single-chip modem-RF SoC design of the T300 enables 60% smaller PCB area compared to legacy 4G/LTE IoT modem solutions.​

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      Fast Data Rates​

      The MediaTek T300 supports high data rates (227/122 Mbps DL/UL in 5G SA mode and 150/75 Mbps DL/UL in legacy 4G/LTE mode).​

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      Future-Proof Connectivity​

      The MediaTek T300 supports 3GPP Rel.17 features for low-power & coverage enhancement as well as small data transmission​

      Next-Gen Connectivity

      Key Modem Technologies​

      Enables LTE & NR-FR1 (20MHz), Up to256 QAM DL/UL, 1T2R MIMO / 1CC, Network slicing & low latency and reliability​

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      Advanced Rel. 17 Power Savings​

      Idle mode features include paging early indication, UE subgrouping, and TRS info. Connected mode support for PDCCH monitoring adaptation & RLM relaxation.​

      Screenshot 2025-11-14 165955

      Block Diagram

      Product Specification

      Processor

      CPU Type

      Arm Cortex-A35

      Max CPU Frequency

      800MHz

      Memory & Storage

      Memory Type

      LPDDR4x

      Max Memory Frequency

      2133MHz

      Peripheral Interfaces

      Key Peripheral Interfaces

      1x PCI-Express 1.0 for connection to external application processor​

      1x USB 2.0

      Cellular Connectivity

      Cellular Technologies

      Sub-6 (FR1) FDD/TDD

      4G LTE FDD/TDD

      1T2R antenna

      20MHz FDD/TDD bandwidth

      DSSA (dual SIM single active)

      3GPP

      Rel. 17 low-power enhancement

      Rel. 17 coverage enhancement

      Rel. 17 small data transmission

      Sub-6GHz Performance

      Up to 227 Mbps peak downlink and 122 Mbps peak uplink (SA)

      Uplink enhancements: power class-2 and 256QAM

      LTE Performance

      Up to 150 Mbps peak downlink and 75 Mbps peak uplink