MediaTek Dimensity 6100+

3GPP R16 Standard Modem

The Dimensity 6100+ features a 3GPP Release-16 standard 5G modem, including the latest connectivity enhancements now deployed by global cellular operators.

MediaTek 5G UltraSave 3.0+

MediaTek 5G UltraSave 3.0+ includes a complete suite of R16 power saving enhancements, plus MediaTek’s own optimizations that results in 13-30% greater power efficiency compared to competitor alternatives in common 5G sub-6GHz connectivity scenarios.

Faster 5G that Reaches Further

Addressing a maximum of 140MHz cellular spectrum enables up to 3.3Gb/s 5G downlink via 2CC carrier aggregation – up to 40% faster downlink speeds within urban environments, and up to 30% in suburbs, versus competitor alternatives. CA can apply mixed duplex FDD+TDD combining low and mid-band advantages, smartphones can access faster speeds and greater reach. Carrier aggregation also enables a seamless handover between two 5G connection areas across a coverage layer, where users receive over 30% greater throughput layer coverage than without CA.

Support for 108MP camera sensors provides highly detailed photos, while advanced noise reduction technologies ensure selfies and low-light captures are always clear, sharp.

• Hardware acceleration for dual cameras & depth perception
• AI-camera enhancements such as AI-color + single camera bokeh

*compared to competitor alternatives

See contour-free true colors with billion color displays that can display real 10-bit images and videos, enhancing the user experience.

Support for display speeds up to 120Hz helps reduce visual fatigue, and provides a supremely smooth user experience, such as page scrolling and animations in apps.

Whole smartphone gaming enhancements that provide longer gameplay, a faster network response and more reliable connectivity to ensure gamers always stay connected.

• 3rd generation 5G Call/Data Concurrency – no missed calls during gaming
• Smooth performance in game engines, demanding scenes, and intense gameplay
• 5G/Wi-Fi concurrency with intelligent connection prediction

TSMC N6 (6nm-class) chip production process ensures its light on power, extending battery life even for demanding smartphone users. MediaTek’s engineering innovations have also created a more compact platform that gives device designs more freedom in their product creations.