Press Room
MediaTek Unveils Super Fast and Power-Efficient 5G Thin Modem Solution for Unparalleled 5G Experiences Beyond Smartphones
10 Nov 2022 - 05:00
Sonoma, Calif. – November 10, 2022 – MediaTek is taking 5G applications and experiences to the next level with the new T800 chipset solution for sub-6GHz and mmWave 5G networks. This fast and power-efficient 5G solution follows the introduction of MediaTek’s T700 5G modem, and will drive innovative 5G “beyond smartphone” applications such as Industrial IoT, M2M, and always-connected PCs.
MediaTek Launches Flagship Dimensity 9200 Chipset for Incredible Performance and Unmatched Power Savings
08 Nov 2022 - 16:00
HSINCHU, Taiwan – November 8, 2022 – MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity to consumers around the globe.
MediaTek’s New Dimensity 1080 Brings a Performance Boost to 5G Smartphones
11 Oct 2022 - 09:00
HSINCHU, Taiwan – October 11, 2022 – MediaTek today unveiled the Dimensity 1080, the newest chipset in the company’s popular Dimensity portfolio for 5G smartphones. The new 5G chipset offers a nice performance bump and significantly upgraded camera features compared to its predecessor, the Dimensity 920.
MediaTek Unveils T830 Platform for 5G CPE Devices Including Fixed Wireless Access Routers and Mobile Hotspots
18 Aug 2022 - 04:30
HSINCHU, Taiwan – August 18, 2022 – MediaTek today announced the latest addition to its 5G portfolio, the T830 platform for 5G fixed wireless access (FWA) routers and mobile hotspot customer-premise equipment (CPE). The T830 is built with MediaTek’s M80 modem which supports advanced Release 16 capabilities for sub-6GHz band operations, making the platform ideal for 5G networks around the globe.
MediaTek Powers World’s First Satellite 5G NTN Smartphone Communication
16 Aug 2022 - 21:00
HSINCHU, Taiwan – August 16, 2022 – MediaTek reached a new 5G milestone by powering a smartphone with a 5G Non-Terrestrial Network (NTN) connection in a lab environment for the first time. Through a transfer of data to ITRI’s Next Generation NodeB network (gNB) test over a Low Earth Orbit (LEO) satellite channel emulated in collaboration with Rohde & Schwarz, MediaTek has demonstrated a...
MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity
23 May 2022 - 09:00
HSINCHU, Taiwan – May 23, 2022 – MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with...
MediaTek Launches Dimensity 8000 5G Chip Series for Premium 5G Smartphones
01 Mar 2022 - 15:00
HSINCHU, Taiwan – March 1, 2022 – MediaTek today launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring flagship level technology – connectivity, displays, gaming, multimedia and imaging features – to premium 5G smartphones.
MediaTek to Showcase 5G, Satellite Communications, Computing and Connectivity Technology Advancements at MWC
21 Feb 2022 - 09:00
BARCELONA, Spain – February 21, 2022 – At MWC 2023, MediaTek will spotlight technology and product highlights from its Dimensity, Filogic, Genio, Kompanio, and Pentonic portfolios, along with a variety of new demos for 5G beyond mobile. MediaTek will also be demonstrating its satellite communications platform and showcasing MediaTek-powered devices across different verticals from some of the...
MediaTek’s T750 Powers NEC Platforms’ New 5G CPE and Mi-Fi Products to be Launched in Japan
15 Oct 2021 - 13:00
HSINCHU, Taiwan – October 15, 2021 – MediaTek and NEC Platforms, Ltd. today announced the first NEC 5G customer-premise equipment (CPE) and mobile Wi-Fi (Mi-Fi) products powered by MediaTek’s T750 5G chipset. This is the first time that MediaTek and NEC Platforms have collaborated on CPE products. These products provide 5G speeds right out of the box and are an affordable broadband alternative to...
MediaTek Announces Dimensity 920 and Dimensity 810 Chips for 5G Smartphones
11 Aug 2021 - 15:00
HSINCHU, Taiwan – August 11, 2021 – MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets, the latest additions to its Dimensity 5G family. This debut gives smartphone makers the ability to provide boosted performance, brilliant imaging and smarter displays to their customers.
