Press Room
First Look at MediaTek’s Helio M70 5G Baseband Chipset
06 12 2018 - 10:00
Guangzhou, December 6, 2018 – Today at the China Mobile Global Partner Conference in Guangzhou, MediaTek’s first 5G baseband chipset Helio M70 was unveiled to the domestic market following its initial launch mid-year. The Helio M70 is among the industry’s first wave of 5G multi-mode integrated baseband chipsets, cementing MediaTek’s status as a leader in the 5G era. In line with the booming 5G...
MediaTek NTTドコモ社のドコモAIエージェントAPIを利用可能な音声アシスタントデバイスを発表
05 12 2018 - 03:00
2018年12月5日-MediaTek Inc. (本社：台湾新竹市、日本法人:メディアテックジャパン株式会社、以下:MediaTek)は、本日世界市場で大きなシェアを得ている音声アシスタントデバイス(VAD)用SoC:MT8516上で、NTTドコモ社（以下「ドコモ社」と表記）のドコモAIエージェントAPIを使用する準備が整ったことを発表致します。MediaTekはVAD向けチップのトップサプライヤーであり、MT8516はスマートホーム機器の開発、および先進の音声入力機能を持つ革新的なAIサービスの導入を容易にします。
MediaTek’s Helio P70 Brings Advanced AI and Premium Upgrades To Mid-Range Devices
24 10 2018 - 14:00
HSINCHU, Taiwan – October 24, 2018 – MediaTek today announced the launch of the MediaTek Helio P70 system-on-chip (SoC), with an enhanced AI engine combined with CPU and GPU upgrades for more powerful AI processing. Helio P70 also comes with upgraded imaging and camera support, a gaming performance boost and advanced connectivity features. The Helio P70 packs all these upgrades into an ultra...
Introducing the New MediaTek Helio A Series Chipset Family to Power More Mid-Market Feature-Rich, Affordable Smartphones
17 7 2018 - 14:00
HSINCHU, Taiwan – July 17, 2018 – MediaTek today unveiled its Helio A series, expanding its Helio family of feature-packed and power-efficient chipsets with the company’s new Helio A22 system-on-chip (SoC). MediaTek’s commitment to continuing to “change everything” can be seen throughout the “Advanced” Helio A series and its mission to power more innovative and more capable smartphones designed...
MediaTek NB-IoT MT2625 SoCのソフトバンクでの相互接続性試験を完了
19 6 2018 - 11:00
MediaTek Inc.は11日、ソフトバンク・グループ（SoftBank Group Corp.）の子会社であるソフトバンク株式会社（SoftBank Corp.以下「ソフトバンク」と表記）とのNarrowBand IoT（NB-IoT）の相互接続性試験がこのほど完了し、将来、NB-IoTアプリケーションを日本国内で商用化していく準備が整ったと発表しました。今回のソフトバンクでの相互接続性試験の完了は、MediaTekが進めている世界市場でのNB-IoTの準備のための努力とコミットメントの一端を示すものである。
モバイル業界が協力し、5G 標準仕様策定が期日どおりに完了
13 6 2018 - 18:00
China Mobile、アンリツ、Asia Pacific Telecom、AT&T、British Telecom、CAICT、CATT、China Telecom、China Unicom、Chunghwa Telecom、Deutsche Telekom、DISH Network、Ericsson、富士通、Huawei、Intel Corporation、InterDigital、Keysight Technologies、KDDI、KT Corp、京セラ、Lenovo、LG Electronics、LG Uplus、MediaTek、Microelectronics Technology Inc.、三菱電機、日本電気、Nokia、NTTドコモ、OPPO、Orange、パナソニック、Qualcomm Technologies, Inc.、Rohde-Schwarz、...
MediaTek Unveils New Helio P22 Chipset to Power Mid-Range “New Premium” Smartphones
22 5 2018 - 22:00
HSINCHU, Taiwan – May 22, 2018 – MediaTek today announced the launch of the Helio P22, the latest addition to the Helio family of powerful and power-efficient chips for the mid-market. With Helio P22, MediaTek continues to expand its Helio P series family that brings high-end features users demand to mid-tier devices.
MediaTek Collaborates with Microsoft to Advance Innovation and Security for the Intelligent Edge
16 4 2018 - 04:00
Hsinchu, Taiwan – April 16, 2018 – MediaTek Inc. today announced that they are collaborating with Microsoft to deliver the first ever Azure Sphere chip, the MT3620, that will drive IoT innovation with built-in security and connectivity. Azure Sphere is a solution for creating highly-secured, connected MCU powered devices at a price that makes enterprise-class security affordable for the multitude...
MediaTek Announces NB-IoT R14 Rate Enhancement Test with China Mobile to Drive Real-World IoT Applications
10 4 2018 - 10:00
Beijing, China – April 10, 2018 – MediaTek recently announced it has completed the NarrowBand IoT Release 14 (NB-IoT R14) rate enhancement tests in collaboration with China Mobile to become the first chip maker to pass the test. A development board based on the MediaTek MT2625 System-on-Chip (SoC) solution was used to achieve the upload rate of 150kbps and download rate of 100kbps. At a data rate...
MediaTek、ASICサービス向けにシリコン実証済みの7nmプロセスで 世界初の完全な「56G PAM4 SerDes」を発表
09 4 2018 - 22:00
MediaTek Inc. (本社：台湾新竹市、日本法人：メディアテックジャパン株式会社、以下：MediaTek)は、ASICサービスのラインナップに7nm FinFETプロセステクノロジーで利用可能な56G SerDes IPチップが新たに加わったことを発表します。MediaTekの56G SerDesは、PAM4シグナルを備えた高性能なDSPベースのソリューションです。電力効率、性能、およびダイ面積でクラス最高を実現します。7nmおよび16nmプロセスのシリコン実証済みのIP開発によって、開発者は、簡単に最先端の製品設計へ統合することができます。
