HSINCHU, Taiwan – April 10, 2025 – MediaTek today announced the Dimensity 9400+ SoC, the latest addition to MediaTek’s Dimensity flagship chipset family. Providing exceptional Generative and agentic AI capabilities as well as other performance enhancements, the Dimensity 9400+ supports the latest Large Language Models (LLM) while sustaining a super power-efficient design.
HSINCHU, Taiwan – Feb. 25, 2025 – MediaTek announced a trio of new ultra-efficient chipsets designed to be an integral part of the industry-leading MediaTek Dimensity family, offering exceptional experiences for high-tech and mainstream mobile devices to complement the flagship and premium offerings of the Dimensity 9400 and 8400. The Dimensity 7400 and 7400X are geared to deliver advanced gaming...
HSINCHU, Taiwan – Dec. 23, 2024– MediaTek today announced the Dimensity 8400, a premium smartphone chip offering the most powerful Gen-AI performance in its class. Building on the legacy of the flagship Dimensity 9400, the MediaTek Dimensity 8400 brings an All Big Core design to the premium smartphone market for the first time. The All Big Core CPU is paired with a powerful NPU to accelerate...
HSINCHU, Taiwan – May 7, 2024 – MediaTek today unveiled the Dimensity 9300+, the latest flagship mobile chip in MediaTek’s Dimensity portfolio. The Dimensity 9300+ offers increased clock speeds and is designed to accelerate on-device generative AI processing, offering broader support for LLMs, and other performance enhancements over the Dimensity 9300.
