MediaTek Genio Pro 5100 | Edge AI Platform

Overview

The MediaTek Genio Pro 5100 delivers an unparalleled level of compute, on-device GenAI and multimedia performance for IoT and embedded application such as autonomous mobile robots, drones, edge AI devices, transportation, and logistics platforms. Build on a leading-edge 3nm process technology, the Genio Pro 5100 integrates an all big octa-core Arm v9.2 architecture, an 8th generation MediaTek NPU supports over 50 TOPS of system-level GenAI acceleration and multimedia features that include an Arm Immortalis-G925 GPU, flexible multi-camera interface support and the ability to drive multiple high-resolution displays simultaneously.

These demanding applications are further supported by a rich Linux software offering including Yocto, Debian and Ubuntu distributions, ROS (Robot OS) framework support, industrial operating temperature and a guaranteed 10-year supply commitment.

Key Features

High Performance Compute

1x Arm Cortex-X925,
3x Arm Cortex-X4 + 4x Arm Cortex-A720
delivers leading single and multi-core performance in compact designs.

Edge GenAI Processing

Integrated 8th Gen NPU delivers over 50 TOPS of GenAI acceleration. Supports up to 7B parameter LLMs at 23 tokens/sec rates.

Powerful Camera Capabilities

Multiple camera support up to 16xFHD cameras with virtual channels.

High-Resolution Display Support

Enables up to three 4K60 displays with advanced 8K video encoding/decoding.

Industrial Systems Ready

Committed long 10-year lifecycle, industrial temperature range & flexible discrete LPDDR5x memory support.

Operating Systems

Supports Yocto Linux, Debian & Ubuntu.

Product Specification

Process

3nm

Processor

Processor (CPU)

1xArm Cortex-X925 (3.1GHz)

3xArm Cortex-X4 (2.8 GHz)

4xArm Cortex-A720 (2.3 GHz)

Graphics Processor (GPU)

Arm Immortalis-G925 MC11

Supports OpenGL, Vulkan, OpenCL

Neural Processing Unit (NPU)

MediaTek 8th Gen NPU 53 TOPS

(4x MDLA5.5 + 2x MVPU, GenAI)

Audio DSP

2x Cadence Tensilica HIFi5 DSP

Memory and Storage

Memory and Type

Discrete 64-bit LPDDR5x up to 8533Mbps (up to 30 GB)

Storage Type

UFS 4.1 (2L)

2x SD 3.0

SPI-NOR (up to 64MB)

Multimedia

Display Interface

3x MIPI-DSI (4L, 2.5Gbps/L)

1x eDP1.5 (4L)

1x DP1.4 (4L, MST)

Display Controller

Up to 3x 4K60 Display

Video-in Interfaces

4x MIPI-CSI (4L)

(Virtual channel: 16x FHD30)

Image Signal Processor

3x ISP

4x MIPI-CSI (4L), Virtual Channel: 16x FHD30

Single Camera: 36MP @30fps

Dual Camera: 36MP + 36MP @ 30fps

Triple Camera: 36MP + 36MP + 36MP @ 30fps

Video Decode

H.265/H.264/AV1/VP9 (8K30)

Video Encode

H.265/H.264 (8K30)

Interfaces

USB

1x USB 2.0 (Host)

2x USB 2.0 (Host/Device)

1x USB 3.2 Gen1 (Host/Device, shared w/ DP)

Ethernet

2x 2.5 GbE MAC (TSN, SGMII)

PCIe

2x PCIe 4.0 (1L, RC, WoWLan)

1x PCIe 4.0 (2L, RC/EP, WoWLan)

UART

6x UART

I2C

7x I2C + 8xI3C

SPI

8x SPI Master

PWM

4x PWM

I2S

8x I2S/TDM input
7x I2S/TDM output

PDM

3x PDM

Temperature support

Temperature

Industrial: -40°C to 105°C (Tj)

Package Information

Package Type

ETFC TFBGA

Package Dimensions

15.9mm x 16.6mm, 0.35mm ball-pitch

Wireless Connectivity

Integrated Wi-Fi Baseband

External Module: 2x2 Wi-Fi 7 + Bluetooth 5.4

Security

ARM TrustZone

Security Boot (RSA4096)

Crypto Engine

RNG