Press Room
MediaTek and TSMC Unveil the World’s First 7nm 8K Digital TV System-on-Chip
22 Nov 2021 - 15:00
Laguna Beach, Calif. – November 22, 2021 – MediaTek (TWSE: 2454) and TSMC (TWSE: 2330, NYSE: TSM) today unveiled the world’s first 7-nanometer 8K digital TV flagship system-on-chip (SoC), the MediaTek Pentonic 2000. Built with TSMC’s N7 advanced process technology, the MediaTek Pentonic 2000 offers unparalleled performance and power efficiency with features including powerful artificial...
MediaTek Announces New Pentonic Smart TV Family with New Pentonic 2000 for Flagship 8K 120Hz TVs
19 Nov 2021 - 03:45
Laguna Beach, Calif. – November 19, 2021 – MediaTek today unveiled its new Pentonic smart TV family with the introduction of the Pentonic 2000, which will power next generation flagship 8K TVs. The MediaTek Pentonic smart TV series is built on MediaTek’s innovative technologies in display, audio, AI, broadcasting and connectivity. Today MediaTek powers more than two billion TVs in the global...
MediaTek Announces New Filogic 130 and Filogic 130A Single-chip Solutions to Bring Wi-Fi 6 and Bluetooth 5.2 Connectivity to IoT Devices
18 Nov 2021 - 05:00
Laguna Beach, Calif. – November 18, 2021 – MediaTek today announced the new MediaTek Filogic 130 and Filogic 130A system-on-chips (SoCs) which both integrate a microprocessor (MCU), AI engine, Wi-Fi 6 and Bluetooth 5.2 subsystems, and a power management unit (PMU) into a single chip. Filogic 130A also integrates an audio digital signal processor to allow device makers to easily add voice...
AMD and MediaTek Develop AMD RZ600 Series Wi-Fi 6E Modules to Enhance Laptop and Desktop PC Connectivity Experiences
18 Nov 2021 - 05:00
Laguna Beach, Calif. – November 18, 2021 – MediaTek and AMD (NASDAQ: AMD) today announced a collaboration to co-engineer industry leading Wi-Fi® solutions, starting with the AMD RZ600 Series Wi-Fi 6E modules containing MediaTek’s new Filogic 330P chipset. The Filogic 330P chipset will power next-generation AMD Ryzen-series laptop and desktop PCs in 2022 and beyond, delivering fast Wi-Fi speeds...
MediaTek’s T750 Powers NEC Platforms’ New 5G CPE and Mi-Fi Products to be Launched in Japan
15 Oct 2021 - 13:00
HSINCHU, Taiwan – October 15, 2021 – MediaTek and NEC Platforms, Ltd. today announced the first NEC 5G customer-premise equipment (CPE) and mobile Wi-Fi (Mi-Fi) products powered by MediaTek’s T750 5G chipset. This is the first time that MediaTek and NEC Platforms have collaborated on CPE products. These products provide 5G speeds right out of the box and are an affordable broadband alternative to...
MediaTek Becomes First Company in Taiwan to Complete Authoritative Global Information Security Assessment BSIMM
14 Oct 2021 - 09:00
HSINCHU, Taiwan – October 14, 2021 – MediaTek announced the successful implementation of the global software security model Building Security In Maturity Model (BSIMM12), making it the first company in Taiwan to be assessed using the authoritative security evaluation system. MediaTek has also been authorized by MITRE to assign Common Vulnerabilities and Exposures (CVE) as a CVE Numbering...
MediaTek Announces Filogic Connectivity Family with New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips
30 Sep 2021 - 02:15
HSINCHU, Taiwan – September 30, 2021 – MediaTek today unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. MediaTek’s new Filogic series of high-performance Wi-Fi 6/6E chipsets provide reliable connectivity, high computation capabilities and a rich set of features in...
MediaTek Announces Kompanio 900T to Enhance Computing Experiences for Tablets and Notebooks
09 Sep 2021 - 15:00
HSINCHU, Taiwan – September 9, 2021 – MediaTek today announced its new Kompanio™ 900T chipset, expanding MediaTek's portfolio of mobile computing solutions for tablets, portable notebooks and other devices. The introduction of Kompanio 900T follows MediaTek’s recent launch of Kompanio 1300T, which is designed for premium tablets. MediaTek’s Kompanio platform combines powerful computing...
MediaTek Announces Dimensity 920 and Dimensity 810 Chips for 5G Smartphones
11 Aug 2021 - 15:00
HSINCHU, Taiwan – August 11, 2021 – MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets, the latest additions to its Dimensity 5G family. This debut gives smartphone makers the ability to provide boosted performance, brilliant imaging and smarter displays to their customers.
MediaTek Introduces the Kompanio 1300T Platform to Enhance Premium Computing Experiences in Tablets
27 Jul 2021 - 14:30
HSINCHU, Taiwan – July 27, 2021 – MediaTek today announced the launch of its Kompanio 1300T, a SoC designed to power incredible experiences across computing devices. Built on the leading 6nm process technology, the chip is bringing premium performance to tablets with advanced 5G, multimedia, AI and gaming technologies for a premium user experience. Kompanio 1300T allows OEMs to build powerful,...
