Press Room
MediaTek Unveils Genio 720 and Genio 520 IoT Platforms for Generative AI Applications
11 Mar 2025 - 20:30
NUREMBERG, Germany – March 11, 2025 – Today at Embedded World, MediaTek introduced the high-performance Genio 720 and Genio 520 edge-AI IoT platforms. These new additions to the Genio series support the latest generative AI models, human machine interface (HMI), multimedia, and connectivity features for smart home, retail, industrial, and commercial IoT devices.
MediaTek Expands Cloud-to-Edge Leadership with Next-Generation Connectivity and AI at MWC 2025
27 Feb 2025 - 07:00
BARCELONA, Spain – February 27, 2025 – At Mobile World Congress 2025, MediaTek is showcasing several key technologies that enable wireless evolution towards 6G, including hybrid computing, a live LEO broadband NR-NTN trial, sub-band full duplex (SBFD), along with the new M90 5G Advanced modem. In addition, the company is also sharing its latest developments in Dimensity Auto and Dimensity...
MediaTek Collaborates with NVIDIA on the New NVIDIA GB10 Grace Blackwell Superchip Powering the NVIDIA Project DIGITS Personal AI Supercomputer
06 Jan 2025 - 20:30
LAS VEGAS – CES – Jan 6, 2025 – MediaTek today announced it has collaborated with NVIDIA on the design of the NVIDIA GB10 Grace Blackwell Superchip for NVIDIA Project DIGITS, a personal AI supercomputer.
MediaTek and Intelligo to Showcase Multiple AI Voice Solutions at CES 2025
06 Jan 2025 - 09:00
LAS VEGAS, NV – Jan. 6, 2025 – MediaTek, a global leader in IC design, and Intelligo, a pioneer in edge AI technology, announced that they will collaborate to deliver innovative AI voice solutions for the automotive, smart home, and smart retail markets, which will debut at CES 2025. The cooperation will be dedicated to transforming how users interact with vehicles and smart home devices,...
MediaTek’s Dimensity 9400 Flagship SoC Offers Extreme Performance and Efficiency for the Latest AI Experiences
09 Oct 2024 - 11:30
HSINCHU, Taiwan – Oct. 9, 2024– MediaTek today launched the Dimensity 9400, the company’s new flagship smartphone chipset optimized for edge-AI applications, immersive gaming, incredible photography, and more. The Dimensity 9400, the fourth and latest in MediaTek’s flagship mobile SoC lineup, offers a massive boost in performance with its second-generation All Big Core design built on Arm’s v9.2...
MediaTek Integrates NVIDIA TAO ToolKit with NeuroPilot SDK for Accelerated Development of Edge AI Applications in IoT
05 Jun 2024 - 16:30
TAIPEI, Taiwan – June 5, 2024 – At COMPUTEX 2024, MediaTek announced it will integrate NVIDIA TAO with MediaTek’s NeuroPilot SDK, part of its edge inference silicon roadmap. MediaTek’s support for NVIDIA TAO will create a seamless experience for developers as they bring edge AI (including Generative AI) capabilities to a wide variety of IoT applications powered by MediaTek’s cutting-edge silicon....
MediaTek Joins Arm Total Design to Shape the Future of AI Computing
04 Jun 2024 - 14:00
TAIPEI, Taiwan – June 4, 2024 – MediaTek announced today at COMPUTEX 2024 that the company has joined Arm Total Design, a fast-growing ecosystem that aims to accelerate and simplify the development of products based on Arm® Neoverse™ Compute Subsystems (CSS). Arm Neoverse CSS is designed to meet the performance and efficiency needs of AI applications in the data center, infrastructure systems,...
MediaTek to Unveil Products for Chromebooks, Smart TVs and Displays at COMPUTEX 2024, Highlighting Demonstrations in AI Processing
04 Jun 2024 - 09:00
HSINCHU, Taiwan – Jun 04, 2024 – At COMPUTEX 2024, MediaTek will showcase new products and technology demonstrations, featuring highlights in AI, Smart TVs, Chromebooks, IoT and more, in addition to a keynote by Vice Chairman and CEO Dr. Rick Tsai about how MediaTek can enable ubiquitous AI.
MediaTek Dimensity 9300 | Flagship Smartphone Performance
07 May 2024 - 10:00
HSINCHU, Taiwan – May 7, 2024 – MediaTek today unveiled the Dimensity 9300+, the latest flagship mobile chip in MediaTek’s Dimensity portfolio. The Dimensity 9300+ offers increased clock speeds and is designed to accelerate on-device generative AI processing, offering broader support for LLMs, and other performance enhancements over the Dimensity 9300.
MediaTek launches next-generation ASIC design platform with co-packaged optics solutions at OFC 2024
20 Mar 2024 - 14:00
San Diego, CA – March 20, 2024 – Ahead of the 2024 Optical Fiber Communication Conference (OFC), MediaTek today announced it is launching a next-generation custom ASIC design platform that includes the heterogeneous integration of both high-speed electrical and optical I/Os in the same ASIC implementation. MediaTek will be demonstrating a serviceable socketed implementation that combines 8x800G...
