MediaTek Dimensity 1050

Seamless sub-6GHz + mmWave 5G Experiences

The MediaTek Dimensity 1050 brings the fastest, lowest-latency connectivity to the widest audience ever via seamless 5G sub-6GHz (FR1) and mmWave (FR2), and Wi-Fi 6E technologies, all built-in to this ultra-efficient 6nm-class chip. Ideal for those that love to capture impressive videos and enjoy their gaming better with a faster display, while also not worrying about battery life.

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Seamless 5G Connectivity

Benefit from a truly seamless 5G experience that fluidly switches between long-reach sub-6GHz and super-fast mmWave connections.

The Dimensity 1050 can connect to both simultaneously, giving up to 53% faster speeds than others that can only connect to 4G LTE and mmWave simultaneously.

Faster Speeds, Greater Reach

  • sub-6GHz (FR1) up to 3CC (200MHz)

  • mmWave (FR2) up to 4CC (400MHz)

In sub-6GHz exclusive domains, the Dimensity 1050 supports the latest 3CC-CA connectivity for faster peak speeds of up to 4.6Gbps, faster average speeds and greater 5G coverage versus competitor alternatives (2CC/120MHz).

True Dual 5G

The Dimensity 1050 supports True Dual 5G SIM (5G SA + 5G SA), giving users consistent 5G speeds from both SIM connections and the opportunity for VoNR to provide the best quality voice and video call experience.

MiraVision 760 with Intelligent, Super-fast Displays

The Dimensity 1050 supports Full HD+ displays up to a super-fast 144Hz refresh rate. Native 10-bit color gives vibrant HDR and a billion-color palette. Support for the latest global HDR video standards includes HDR10+ Adaptive, CUVA HDR-vivid, HLG and Dolby Vision.

High-speed displays provide notably smoother everyday experiences like scrolling and animations in apps. MediaTek Intelligent Display Sync technology improves the power efficiency of fast displays by dynamically adjusting the refresh rate to only enable faster speeds when it’s needed most.

Imagiq 760 with Dual HDR Video Capture Engine

Using technologies first premiered in the Dimensity 9000 and 8000 Series, the Imagiq 760 HDR-ISP provides a dual HDR video capture engine that can record on two cameras simultaneously, giving users unique streaming/videography opportunities to record selfie + environment, or different frames of the same view, such as wide + zoom, to never miss a moment.

Device makers can build multi-camera smartphones with main cameras up to 108MP, while making use of the highly capable MediaTek APU 550 to apply excellent noise reduction techniques for superior low-light photos.

MediaTek APU 550

The MediaTek APU 550 upgrades the efficiency and functionality of computer vision (CV) operations versus previous MediaTek APU designs. Further generational improvements to the multi-tasking scheduler ensures low latency and power-efficiency in all AI-tasks. In addition to standard INT8 and INT16 instructions, the APU 550 can also natively process FP16 for precision-reliant actions.

Powerful Performance

The Dimensity 1050 features two Arm Cortex-A78 CPUs with frequencies up to 2.5GHz, offering snappier performance in apps, faster loading webpages and better FPS in games. Using the latest Arm Mali-G610 graphics engine means the Dimensity 1050 provides great gaming performance and improved efficiency versus previous generation Mali designs, while UFS 3.1 storage and LPDDR5 memory supplies these powerful processors the fastest data streams.

HyperEngine 5.0 gaming technologies

MediaTek HyperEngine 5.0 gaming technologies make smarter use of CPU and GPU resources when gaming to improve power efficiency. The technology suite features exclusive AI-based Variable Rate Shading (AI-VRS), MediaTek Intelligent Display Sync, plus Wi-Fi and 5G optimisations to ensure lower-latency connections to the game server.

Latest Wi-Fi 6E

Wi-Fi 6E (2x2 MIMO) is built right into the chip, giving the Dimensity 1050 superior power efficiency compared to competitor platforms use of external Wi-Fi chip solutions. Wi-Fi 6E is the latest standard that introduces tri-band (2.4GHz, 5GHz, 6GHz) connectivity, giving users faster, lower-latency local network connections.

Exceptionally Power-efficient Chip

Using the advanced TSMC N6 (6nm-class) production process means the Dimensity 1050 is exceptionally light on power, extending battery life even for the most demanding smartphone users.

Specifications

Processor

Processor

  • Arm Cortex-A78 @ 2.5GHz
  • Arm Cortex-A55 @ 2.0GHz

Cores

Octa (8)

CPU Bit

64-bit

Heterogeneous Multi-Processing

Yes

Memory and Storage

Memory Type

  • LPDDR5
  • LPDDR4X

Storage Type

  • UFS 3.1
  • UFS 2.1

Connectivity

Cellular Technologies

Sub-6GHz (FR1), mmWave (FR2), 2G-5G Multi-Mode, 5G-CA, 4G-CA, 5G FDD / TDD, 4G FDD / TDD, TD-SCDMA, WDCDMA, EDGE, GSM

Specific Functions

SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, FR1 TDD+FDD, DSS, FR1 DL 3CC up to 200 MHz, FR2 DL 4CC up to 400MHz, 256QAM FR1 UL 2CC, 256QAM VoNR / EPS fallback

GNSS

GPS L1CA+L5 / BeiDou B1I+ B2a / Glonass L1OF / Galileo E1 + E5a / QZSS L1CA+ L5 / NavIC

Wi-Fi Antenna

2T2R

Wi-Fi

Wi-Fi 6E (a/b/g/n/ac/ax)

Bluetooth Version

5.2

Display

Max Display Resolution

2520 x 1080

Max Refresh Rate

144Hz

AI

AI Accelerator

MediaTek APU 550

Graphics

GPU Type

Arm Mali-G610 MC3

Video Encoding

  • H.265 / HEVC
  • H.264

Video Encoding FPS

4K @ 30FPS

Video Playback

  • H.265 / HEVC
  • H.264
  • MPEG-1/2/4
  • VP-9

Video Playback FPS

4K @ 30FPS

Camera

Max Camera ISP

  • 108MP
  • 20MP + 20MP

Max Video Capture Resolution

3840 x 2160

Camera Features

  • Dual HDR video capture hardware
  • 3X HDR-ISP
  • MFNR
  • 3DNR
  • AINR
  • Hardware Depth Engine
  • Warping Engine