MediaTek Dimensity 1300

The Dimensity 1300’s octa-core CPU features four premium Arm Cortex-A78 processors, including an ‘ultra-core’ operating up to 3GHz. Built using the TSMC N6 (6nm-class) production process, the Dimensity 1300 is an incredibly efficient chip design for extended everyday battery life.

MediaTek HyperEngine 5.0 provides a comprehensive suite of gaming-related optimizations such as exclusive AI-VRS, Wi-Fi/Bluetooth Hybrid 2.0, plus wireless earbud latency improvements from Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.

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The Dimensity 1300 boosts AI benchmark scores from the six-core NPU 3.0 by up to 10%, giving greater capacity for AI tasks. The MediaTek NPU 3.0 features an advanced multi-tasking scheduler to maximize performance and efficiency while handling a wide range of simultaneous tasks.

New AI-camera enhancements include improved night shot photography and HDR capabilities for great image clarity. ‘Staggered’ 4K HDR video recording uses real-time 3-exposure fusion to provide 40% greater dynamic range versus standard 4K HDR video capture.

The Dimensity 1300 supports super-fast refresh rate displays, giving users impressive, zero-lag visuals in gaming, plus notably improved everyday experiences from smoother scrolling of webpages, social streams, and animations in apps.

MediaTek MiraVision provides an exclusive range of HDR video playback and display technologies that bring cinema-grade visual experiences to the small screen.

Built into the chip, the 5G modem offer deeply engrained power saving enhancements, super-fast 5G NR performance and range with mixed-duplex 5G carrier aggregation, and true dual 5G SIM capability. ‘5G Elevator Mode’ & ‘5G HSR Mode’ specialist enhancements ensure seamless 5G experiences with immediate recovery time and reliably faster speeds, respectively.

Dimensity 5G Open Resource Architecture allows device makers to create unmatched 5G smartphones that truly stand out.