MediaTek Insights

MediaTek Dimensity Auto is shaping the future of connected vehicles at MWC 2026.

We are proud to share that the MediaTek Dimensity 9500 has been honored with the Innovative Product and Solution Award at the GTI Awards 2026, recognizing its outstanding advancements in mobile technology. This marks the second consecutive year we've received a GTI Award, underscoring our sustained...

The MediaTek Dimensity 9500 is redefining what smartphone cameras and NPUs can do at MWC 2026.

On March 2, 2026, MediaTek and the Singapore University of Technology and Design (SUTD) held a signing ceremony to mark the launch of a joint 6G research laboratory, with a total committed investment of over S$34 million to accelerate the development of 6G technologies.

We’re days away from MWC Barcelona 2026. This year’s event, themed “The IQ Era,” explores how the latest AI, multimedia, and connectivity technologies are transforming product design and how we interact with the world around us. Simply put, devices and networks are becoming smarter and more...

AI is reshaping the technology landscape, driving a shift toward on-device intelligence. Jenna Ezarik asks MediaTek's PD Rajput about the biggest opportunities in notebooks and client computing. From AI workstations to Chromebooks and Gemini on-device, this is MediaTek’s perspective on the...

At ISSCC 2026, Rick Tsai, Vice Chairman and CEO of MediaTek, delivered a compelling keynote titled “Advancing Horizons for AI: Perspectives on Semiconductor Innovations." In his address, Tsai explored how breakthroughs in semiconductor design are accelerating the next wave of artificial...

Executive Interview with PD Rajput, VP, Computing Platforms Business Unit, MediaTek. This conversation between PD Rajput, VP of MediaTek's Computing Platforms Division, and industry analyst Anshel Sag of Moor Insights & Strategies discusses how devices like the DGX Spark are redefining what is...

A MediaTek team has received the ISSCC 2025 Anantha P.Chandrakasan Distinguished Technical Paper Award for its paper presenting a 212.5Gb/s DSP-based PAM4 transceiver fabricated using TSMC 4nm FinFET technology.